Senior Digital Hardware Design Engineer; Onsite

Senior Digital Hardware Design Engineer

Position located in McKinney, TX. This is an onsite role requiring U.S. citizenship and a current Secret-level security clearance.

The Multi-Product Power & Digital (MPD) department designs FPGAs, circuit cards, and electronics subassemblies for missile systems, radars, and electronic warfare. Our team leverages digital, analog, and power design skills to support the product lifecycle from architecture through production and sustainment.

• Assist with requirements decomposition and trade studies.
• Define architecture at the circuit card level.
• Lead the design, analysis, test, and documentation of digital electronics circuit card assemblies including embedded processors, FPGAs, memories, and industry‑standard interfaces such as PCIe, Ethernet, I2C, SPI, and UART.
• Partner with ECAD drafters through stack‑up definition, pre/post‑route simulation (SI/PI), layout, and routing activities.
• Plan and execute integration and verification activities in engineering laboratories.
• Provide product test and troubleshooting support.
• Support root‑cause failure investigations.
• Define schedules for circuit‑card level tasking and drive execution to the planned budget and schedule.
• Lead individual designs and/or small teams with minimal oversight.
• Support internal and external technical reviews.
• Engage in knowledge‑transfer activities and mentor junior engineers.

• Degree in STEM and a minimum of 5 years of relevant experience.
• Design, analysis, simulation, and/or test experience with digital electronic circuit designs including processors, FPGAs, high‑speed transceivers, DDR, and flash memories.
• Experience maturing design concepts from block diagram or requirements level to completed, verified digital designs.
• Expertise with a schematic capture/circuit board layout CAD package.
• Experience with standard lab equipment for integration and verification testing of hardware designs.
• Advanced degree in Electrical Engineering or related STEM field preferred.
• Embedded test techniques, design for test, design for manufacturing, and design margin analysis experience.
• Formal design process for circuit card assemblies knowledge.
• Ability to debug and resolve hardware issues during integration and qualification testing.
• General knowledge of high‑speed protocols such as PCIe, Ethernet, and high‑speed memory interfaces.
• Experience with Siemens Xpedition (xDX Designer, xPCB Layout, Hyperlynx) signal/power integrity.
• Experience with complex circuit card assemblies between 16 and 32 layers.
• Experience guiding ECAD personnel through PCB layout and technical drawing creation.
• Knowledge of software and/or FPGA code development.
• Experience documenting technical topics and presenting to leadership.
• Demonstrated ability to lead teams to achieve schedule, budget, and technical commitments.
• Project management tools experience such as Earned Value and/or Agile Execution.
• Proposal development experience.

• Relocation assistance based on eligibility.
• Salary range: $86,800 – $165,200 USD per year (good‑faith estimate).
• Medical, dental, vision, life insurance, short‑term and long‑term disability, 401(k) match, flexible spending accounts.
• Flexible work schedules, employee assistance program, Employee Scholar Program, parental leave, paid time off, holidays.
• Annual incentive compensation programs (short‑term and long‑term) depending on level and collective‑bargaining status.
• Benefits eligibility applies to U.S.
  
  -based roles; specific benefits may vary by business unit.

RTX is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, veteran status, or any other applicable protected class. RTX provides affirmative action in employment for qualified individuals with a disability and protected veterans in compliance with applicable laws.

This role is U.S.

-based. If the successful candidate resides in a U.S. territory, the appropriate pay structure and benefits will apply. The application window is approximately 40 days from the posting date but may be adjusted.