Thin Film Manufacturing Engineer

Position Overview

The Advanced Products Center (APC) Manufacturing Engineering organization seeks a process engineer to support manufacturing operations and drive advancements in thin film processes. The role focuses on manufacturing support, process development of custom multi‑layer products and processes such as thin film metal deposition, laser drilling, photolithography, electroless/electroplating, and wet chemical etching. The engineer will optimize process yields, address production challenges, and ensure product quality, collaborating across cross‑functional teams.

U.S. citizenship is required. No security clearance is required.

• Provide engineering and production support for multiple thin film processes including PVD metal deposition, laser drilling, photolithography, electroplating, electroless plating, and wet chemical etching.
• Collaborate with cross‑functional teams to support manufacturing operations and process development from a materials perspective, including failure analysis and materials qualifications.
• Support process improvement activities utilizing statistical process control (SPC) techniques and experimental designs.
• Support materials, equipment, and manufacturing processes, including qualification, acceptance testing, and specification development.
• Support process and design improvements through Root Cause and Corrective Action (RCCA), lessons learned, and defect analysis.
• Provide equipment and process training to manufacturing operators, ensuring alignment with materials and process requirements.
• Support production with on‑site responsiveness to factory equipment, process, materials, and product problems.
• Factory production execution support includes developing and implementing well‑controlled processes using data‑driven methods such as SPC and DOE and writing shop process documentation.
• Develop and execute new product builds typically with automated equipment, often requiring creative solutions for next‑generation product designs.
• Process improvement projects to improve factory productivity through new technologies, new materials, and equipment down‑selection and integration.
• Effective cross‑functional communication of technical information.

• Degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 2 years of relevant experience (unless prohibited by local laws).
• Experience in one or more of the following thin film processes: metal deposition, sputtering, laser drilling, photolithography, plating, wet chemical etching.
• Experience working with a multi‑disciplined engineering team for technical issue resolution and root cause investigation.
• Experience with automated equipment used in manufacturing.
• U.S. citizenship is required.

• Process development and qualification experience.
• Statistical Process Control (SPC) and statistical data analysis experience.
• Design of Experiments (DOE) techniques.
• Technical writing experience for operator instructions, process and/or material qualification reports, equipment vendor statement of works.
• Experience with material properties or automated equipment.
• Experience with MS Office 365.

• Medical, dental, and vision coverage.
• Life insurance.
• Short‑term and long‑term disability insurance.
• 401(k) match.
• Flexible spending accounts.
• Flexible work schedules.
• Employee assistance program.
• Employee Scholar Program.
• Parental leave.
• Paid time off and holidays.

No relocation assistance is provided for this role. The position is a U.S.

-based onsite role.

RTX is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, veteran status, or any other applicable state or federal protected class. RTX provides affirmative action for qualified individuals with a disability and protected veterans in compliance with Section 503 of the Rehabilitation Act and the Vietnam Era Veterans’ Readjustment Assistance Act.