Microelectronics Engineer

This is a proposal requisition. Work will begin only if the contract is awarded.

Orbis is looking for a Microelectronics Engineer (Subject Matter Expert) to support mission objectives in the Washington Metro Area. This role emphasizes technical assessment and data‑driven analysis across microelectronics fabrication and advanced packaging—not day‑to‑day tool operation.

• Provide subject‑matter expertise in microelectronics/semiconductor fabrication and advanced packaging, including physical/chemical vapor deposition; dielectrics (including spin‑on); metals; superconducting materials; dry/wet etch; photolithography; failure analysis; semiconductor metrology; CMP; FEOL/BEOL; semiconductor product development; process control; and sustainment.
• Evaluate technical proposals, white papers, and test data for feasibility, risks, maturity, and operational relevance, document findings and recommendations for stakeholders.
• Analyze unstructured and structured process/metrology/yield datasets; perform root‑cause analysis on external and internal processes to identify opportunities for improvement and answer mission questions.
• Establish lightweight processes for data transformation, workload management, data structures, dependencies, and metadata to support repeatable analysis and decision support.
• Collaborate with Systems Engineers, System Integrators, and mission engineering teams; provide clear briefings and concise technical documentation as required.

This position has no supervisory responsibilities.

• Bachelor’s degree in electrical engineering, materials science, physics, micro/nanotechnology, or a closely related field; or an equivalent combination of education and experience.
• Demonstrated experience providing microelectronics/advanced packaging subject‑matter support and data‑driven assessments (proposal/test data reviews, root‑cause analysis).

• Master’s degree (or higher) in a relevant technical discipline.
• Familiarity with superconducting or compound semiconductor devices, or radiation‑hardened microelectronics.
• Exposure to reliability/qualification concepts (e.g., HTOL, temperature cycling, ESD/latch‑up).

• U.S. Citizenship.
• Active TS/SCI with Polygraph security clearance.
• Strong analytic skills working with unstructured datasets and complex technical information.
• Ability to perform root‑cause analysis and communicate actionable insights.
• Ability to build processes that support data transformation, workload management, data structures, dependency, and metadata.
• Excellent written and oral communication skills for effective collaboration in virtual and on‑site environments.
• Strong time and task management skills.

• Prolonged periods working at a computer; routine video conferences and/or in‑person meetings.
• Ability to attend planned meetings across the Washington Metro Area.
• Work may be performed in classified environments per Sponsor direction.

We are an equal opportunity employer, and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender identity, sexual orientation, national origin, disability, or protected veteran status.