Engineer II - Chip & Flowcell Assembly and Packaging

Engineer II - Chip & Flowcell Assembly and Packaging page is loaded## Engineer II - Chip & Flowcell Assembly and Packaging locations:
US - California - Menlo Parktime type:
Full time posted on:
Posted Yesterday job requisition :
JR100804

Engineer II - Chip & Flowcell Assembly and Packaging    

Job Summary We are seeking a highly motivated and hands-on Engineer II to join our Chip and Flowcell Assembly & Packaging team. This role is ideal for an early-career engineer who is eager to work directly in the lab, gain deep expertise in semiconductor and biochip packaging, and contribute to experimental development, process characterization, and assembly support.

As an Engineer II, you will be closely involved in day-to-day laboratory work while also supporting senior engineers in technical interactions with external vendors and suppliers. This role provides strong exposure to both internal development and external manufacturing ecosystems.

Responsibilities
* Perform hands-on laboratory experiments to support chip and flowcell assembly and packaging development.
* Assist with development, execution, and documentation of packaging and assembly processes for biochips and consumables.
* Support process characterization, DOE execution, data collection, and analysis.
* Operate, maintain, and help troubleshoot lab tools and assembly equipment.
* Assist with material evaluation, process optimization, and yield improvement activities.
* Support senior engineers in partnering with external vendors, suppliers, and manufacturing partners, including:
Preparing technical documentation and data packages;
Participating in technical reviews, calls, and on-site visits;
Supporting evaluation of vendor processes, materials, and capabilities.
* Collaborate with cross-functional teams including process engineering, design, NPI, and manufacturing.
* Document experimental results, procedures, and learnings in a clear and organized manner.
* Support transfer of processes from development to manufacturing.
* Follow cleanroom, lab safety, and quality procedures.

Required Qualifications
* Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, Chemical Engineering, Biomedical Engineering, or a related field.
* A minimum of 1-3 years of industry or relevant academic experience (internships, co-ops, or research experience acceptable).
* Strong interest in hands-on lab work and experimental development.
* Willingness and enthusiasm to be trained in semiconductor packaging, biochip assembly, and consumable manufacturing.
* Ability and interest in working with external vendors and suppliers under guidance from senior engineers.
* Strong attention to detail, curiosity, and a willingness to learn.
* Ability to work effectively in a fast-paced, team-oriented environment.
* Excellent interpersonal, written, and verbal communication skills.

Preferred Experience
* Familiarity with basic semiconductor, MEMS, microfabrication, or packaging concepts is a plus.
* Experience with data analysis, DOE, or lab documentation is a plus.

Candidates must have current authorization to work in the United States without the need for present or future sponsorship.

Non-Field Based Employees are required to be onsite Monday-Friday.

You may be required from time to time to visit and work at Pac Bio locations and for such times as the Company considers necessary for the proper performance of your duties.

All listed tasks and responsibilities are deemed as essential functions to this position; however, business conditions may require reasonable accommodations for additional tasks and responsibilities.

All qualified applicants will receive consideration for employment without regard to race, sex, color, religion, national origin, protected veteran status, or on the basis of disability, gender identity, and sexual orientation.#LI-Onsite
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