Packaging Design Architect

Responsibilities

• Drives end-to-end development for substrate design from concept through tape out
• Implements physical layout and routing of the package design
• Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs
• Works closely with silicon and hardware teams to optimize silicon-package-board performance and pinout
• Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design
• Completes documentation and collateral into the product lifecycle management system of record

• Ph.D./master’s in electrical engineering/ chemical engineering/ mechanical engineering or Material Science
• 10+ years and in-depth knowledge/background in Package, PCB design, or IC digital design
• Solid background in semiconductor fabrication and packaging
• Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions
• Experience with design and electromagnetic simulation tools:
  Mentor, Cadence tools, SPICE, Ansys tools etc.
• Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx)