Senior Member of Technical Staff, Engineer

Responsibilities

• Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes
• Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield
• Own and resolve complex CMP-related yield and manufacturing issues using data‑driven approaches and structured problem‑solving methodologies
• Align technical strategies with customer requirements and business objectives, ensuring on‑time delivery of robust solutions
• Bridge technology development and manufacturing teams to ensure smooth transition of CMP processes to production
• Drive ongoing optimization initiatives to enhance process capability, yield, and manufacturing efficiency
• Work closely with Integration, Device, Yield, Factory, Quality, and Customer Engineering teams
• Collaborate with equipment and consumables suppliers to co‑develop and optimize CMP solutions
• Mentor junior engineers and provide technical guidance across the organization

• Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field
• 7+ years of experience in semiconductor manufacturing/process development or technology development
• 4+ years of direct experience in Chemical Mechanical Planarization (CMP) process development experience with hands‑on process tuning and characterization
• Experience with major CMP equipment platforms in one of the following platforms (AMAT, Ebara, etc.)
• Experience with CMP consumables (e.g. slurries, pads, conditioning disks, filters, clean chemistries)
• Previous semiconductor foundry experience

• Master's degree in Chemical Engineering
• Master's degree in Materials Science
• Master's degree in Electrical Engineering
• Master's degree in Mechanical Engineering
• Master's degree in Physics