Core Technologist, Wiresaw

Location: Hemlock

Core Technologist, Wiresaw

** Date:
** Apr 27, 2026

*
* Location:

** Hemlock, MI, US, 48626

** Company:
** Corning

Requisition Number: 72181

** The company built on breakthroughs. ​ *
* ** Join us.​ *
* Corning is one of the world's leading innovators in glass, ceramic, and materials science. From the depths of the ocean to the farthest reaches of space, our technologies push the boundaries of what's possible.  ​ 

How do we do this? With our people. They break through limitations and expectations - not once in a career, but every day. They help move our company, and the world, forward. ​ 

​At Corning, there are endless possibilities for making an impact. You can help connect the unconnected, drive the future of automobiles, transform at-home entertainment, and ensure the delivery of lifesaving medicines. And so much more.​ 

​Come break through with us. 

Our Solar business delivers industry leading, U.S.

-made solar components. We manufacture hyper-pure polysilicon, high-quality solar wafers, and innovative photovoltaic modules, leveraging our leadership in advanced manufacturing to serve growing energy demand. You will be a part of advancing critical U.S. supply chains and delivering unmatched quality and reliability to customers.

** Role Purpose*
* The Senior Wiresaw Process Engineer will serve as the technical leader for diamond-coated wire (DCW) wafer slicing operations, driving process optimization, quality control, and reliability improvements. This role is critical to ensuring high-quality solar wafer production by leveraging deep expertise in wiresaw slicing parameters, equipment, and materials. The engineer will lead troubleshooting, implement corrective actions, and mentor teams while collaborating cross-functionally to enhance yield, reduce costs, and support continuous innovation in wafer manufacturing.

** Key Responsibilities*
* + SME for wiresaw slicing processes, including recipe parameter optimization, throughput increase and equipment maintenance, while ensuring the production of high-quality solar products.

+ Identify opportunities for process optimization to improve yield, reduce costs, and enhance overall efficiency in wiresaw slicing operations.

+ Develop and implement robust quality control measures to ensure the highest standards of wafer quality are maintained, including thickness uniformity, surface roughness, and defect density.

+ Lead efforts to troubleshoot technical issues related to wiresaw slicing, identify root causes, and implement corrective actions to address process deviations and improve process reliability.

+ Maintain accurate documentation of wiresaw slicing processes, procedures, and technical specifications, and prepare comprehensive reports to communicate findings, recommendations, and project updates to stakeholders.

+ Apply statistical analysis, DOE, and SPC methods to optimize processes and ensure data-driven decision-making.

** Work Hours*
* + Standard Hours (Monday - Friday, 8am-5pm)

+ Working in a 24/7 plant structure. Off hour evening and weekend team rotations or call-in support will be required

** Education and Experience*
* + Bachelor's degree or higher in engineering, materials science, or a related field

+ 3-5 years of experience in manufacturing or a closely related field, with a proven track record of technical leadership and expertise.

** Required Skills*
* + In-depth knowledge of solar manufacturing diamond wire saw processes, equipment, and materials.

+ Strong analytical and problem-solving skills, with the ability to identify root causes of technical issues and implement effective solutions.

+ Solve technical issues pertaining to diamond wire saw process used for making thin solar or semiconductor wafers.

** Desired Skills*
* + Ability to thrive in a fast-paced and dynamic environment, with a willingness to adapt to changing priorities and requirements.

** This position does not support immigration sponsorship.*
* The range for this position is $82,157.00 - $ assuming full time status. Starting pay for the successful applicant is dependent on a variety of job-related factors, including but not limited to geographic location, market demands, experience, training, and…