Field Application Engineer - Defense & Aerospace

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About TCLAD: TCLAD is a U.S.

-based leader in thermal management and metal‑clad printed circuit board (MCPCB) solutions for high‑power electronics. Our technologies enable reliable performance in demanding applications where heat, isolation, and power density drive design complexity — from defense systems and aerospace power modules to electrification and data infrastructure.

Job Summary:

The Field Applications Engineer (FAE) will serve as the primary external technical support for TCLAD’s customers in the Defense & Aerospace market and TCLAD’s sales and engineering team. This role will collaborate with customers to identify and drive differentiated value and design‑in opportunities, translate application requirements into manufacturable PCB solutions, and support business growth through technical credibility, design wins, and customer advocacy.

• Drive design wins by engaging with engineering teams at Defense & Aerospace customers to secure design‑ins of TCLAD’s thermally conductive PCB products.
• Provide application and design guidance related to thermal performance, dielectric materials, and board stack‑ups for high‑power applications.
• Create trust and increase TCLAD’s brand value by acting as the primary technical contact for target accounts, from concept through qualification and into production.
• Collaborate closely with TCLAD’s product engineering, manufacturing, and sales teams to align technical solutions with customer needs.
• Identify new project opportunities and influence specifications that drive long‑term business growth.
• Deliver product presentations, application notes, and design support materials to engineering and procurement teams.

• B.S. in Electrical, Mechanical, or Materials Engineering, or related field.
• 7+ years in Field Applications, Design Engineering, or Technical Sales roles.
• Proven history of design wins leading to measurable business growth.
• Strong network within Defense & Aerospace OEMs, Start‑ups and Tier 1s (Raytheon, Collins Aerospace, Northrop Grumman, Lockheed Martin, etc.).
• Experience with high‑power electronics, power management systems, and PCB application preferred.
• Understanding of IPC standards, MIL‑spec qualifications, and Defense/Aerospace material requirements.
• Excellent communication and presentation abilities; strong problem‑solving and customer advocacy skills.
• US citizen

• Strategic thinker with a proactive approach.
• Strong analytical and problem‑solving skills.
• Ability to work in a fast‑paced, dynamic environment.
• High level of integrity and professionalism.