Director, Technology Marketing

Overview

STATSChipPAC is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services that include semiconductor package integration design and characterization、R&D、wafer probe、wafer bumping、package assembly、final test and drop shipment to vendors around the world.

Qualified candidate will be responsible to create business development plans in support of strategic markets driven by applications, factory product lines, and R&D initiatives. Drive new business, increase market share of the existing business with the sales team. Develop opportunities with new customers, new product lines within existing customers, and for advanced packaging technology. Work with R&D team to assess gaps between customers and OEM technical requirements, competitor capabilities and STATS’s capabilities.

Represent STATS at customer technical review meetings /business review meetings as requested by Sales team. Candidates must be technically proficient in semiconductor package assembly, test, market, customer interface, and team work.

• Create and lead business development plans in support of strategic markets, factory product lines, and R&D initiatives.
• Identify product, strategic market, and customer issues and communicate required courses of action to factory, work closely with regional sales team to develop account list, generate account and regional growth plans and identify and execute on target opportunities.
• Assists Sales department in providing technical product/service information.
• Own the Market Requirements Specifications (MRS) document process and Statement of Work (SOW) for launching R&D projects
• Take lead and represent STATS in industry organizations by serving on committees, chairing conferences.
• Attending key networking events to promote and pitch STATS
• Author technical papers in the international conferences and speak at industry events to promote STATS.
• Executive interface with technical teams for key accounts
• Provide customer technical support for projects that require development or technical expertise

• Broad expertise and unique knowledge, uses skills to contribute to development of company objectives and principles and to achieve goals in creative and effective ways
• Exercises independent judgment in methods, techniques and evaluation criteria for obtaining results. Creates formal networks involving coordination among groups.
• Acts independently to determine methods and procedures on new or special assignments
• Typically requires a minimum of 15 years of related experience with a Bachelor’s degree; or 12 years and a Master’s degree; or a PhD with 10 years’ experience; or equivalent experience
• Extensive experience in the semiconductor industry especially in OSAT business development, or engineering work related to semiconductor packaging industry.
• Very good understanding of semiconductor packaging technology such as wirebond, flip chip, wafer level, 2.5D/3D packaging including wafer bump and test.
• Good understanding of package design and tools, mechanical, thermal and electrical simulation work
• Excellent program management skills
• Able to analyze market data and sales strategy
• Excellent verbal and written communication skills
• Self-motivated and self-directed, able to multi-task, prioritize, and manage time effectively in diverse work environments.
• Proficient computer skills, Microsoft Office (Word, PowerPoint, Outlook, and Excel), etc.