CMP Process Engineering Technician

Title

CMP Process Engineering Technician

Under the direction of the Sr. Manager, CMP Process Development, the CMP Process Technician supports engineering teams in the CMP area, assists with wafer fabrication, reviews and documents CMP processes or procedures, and handles abnormal wafers for rework. The role maintains process controls using Statistical Process Control (SPC), collects and analyzes data, recommends corrective actions, and performs microscopy inspection using Atomic Force Microscopy (AFM) and Focused Ion Beam (FIB) techniques.

This position is located in Milpitas, California.

• Provides support to engineering teams in the CMP area.
• Supports wafer fabrication and CMP processes to ensure efficient wafer processing.
• Reviews and documents processes and procedures; partners with engineering to implement changes effectively.
• Disposes of abnormal or atypical wafers for rework, ensuring timely completion.
• Collects and analyzes data, recommending corrective action when required.
• Maintains process controls using SPC, preparing charts and graphs.
• Performs inspections using AFM and FIB microscopy.
• Assists with troubleshooting and resolving process-related issues.
• Participates in continuous improvement initiatives, recommending modifications to procedures or processes.
• Collaborates with engineering to qualify or approve new processes or procedures.
• Creates reports, charts, or graphs on an ad-hoc or routine basis.
• Responds to inquiries from team members, managers, or departments.
• Adheres to all safety policies and procedures.
• Performs other duties of a similar nature or level.

• Associate’s degree in Electronics, Industrial Technology, or equivalent experience.
• At least two years’ experience in the semiconductor industry.
• Knowledge of CMP processes and procedures.
• Proficient in Microsoft Office applications.
• Knowledge and ability to use various microscopes, including AFM and FIB.
• Understanding of semiconductor or hard disk drive (HDD) principles and processes.
• Ability to use SPC to maintain process controls.
• Ability to collect and analyze data, present findings, and recommend corrective action.
• Strong safety awareness and commitment to safety policies.
• Effective communication skills at all levels.
• Demonstrated ability to follow verbal or written instructions.
• Problem‑solving, organizational, time‑management, and prioritization skills.
• Speedy issue resolution and flexible prioritization.

The CMP Process Technician works primarily in an indoor, class
100 ESD‑sensitive wafer manufacturing facility on a rotating B or D shift (typically Monday‑Wednesday or Friday‑Sunday, with alternating Thursday evenings from 6:00PMto 6:00AM). Work may require travel between buildings, wearing a cleanroom suit and protective equipment. Tasks involve standing, walking, fine grasping movements, bending, twisting, operating a computer and other office equipment, and occasionally pushing, pulling, or lifting up to 10pounds.

Hourly rate $25.00–$35.00 plus bonus target and benefits. The rate may vary based on responsibilities, knowledge, skills, abilities, education, and experience. The range is subject to change.

TDK/Headway Technologies, Inc. provides equal employment opportunities to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation to complete the application process should contact Headway Human Resources.