Thermal Mechanical Engineer

Job Summary

The system engineering department is hiring a thermal mechanical engineer. You will be responsible for performing structural and thermal simulations to optimize the design of electro‑optical sub‑assemblies. Your work will directly impact the performance and reliability of our quantum computer sub‑systems.

• Develop detailed FEA/CFD models of components, packages, optical‑electronic modules, and system‑level assemblies using appropriate simulation tools such as ANSYS, COMSOL, or equivalent platforms.
• Correlate FEA results with experimental measurements, prototype test data, and hardware observations to improve model fidelity and support simulation‑driven design decisions.
• Perform warpage and deformation analysis for multimaterial assemblies, accounting for mismatch in thermal expansions, nonlinear material behavior, temperature gradients, and boundary conditions.
• Develop thermal cycling and mechanical fatigue models to predict long‑term reliability, including creep, stress relaxation, and interface degradation.
• Identify mechanical risk drivers and recommend design, material, or process changes to improve robustness, manufacturability, and yield.
• Analyze failures related to electro‑optical assembly design and provide solutions. Conduct general design activities such as requirements management, materials and component selection, FMEA, and tolerance analyses.
• Develop end‑to‑end simulation workflows to automate processes, assess performance across diverse operating scenarios, and improve efficiency, accuracy, and repeatability.
• Document and communicate results through clear technical reports, design reviews, and executive‑level summaries.

• M.Sc. or Ph.D. in Mechanical Engineering, Electrical Engineering, Physics, or a related field.
• 5+ years of hands‑on modeling and simulation experience in the semiconductor industry.
• Strong understanding of thermal conduction and convective heat transfer methodologies.
• Deep knowledge of solid mechanics principles, including stress, strain, fatigue, creep, and constitutive models of elastic, visco‑plastic, and plastic materials.
• Proficiency with simulation tools such as ANSYS (Mechanical, Icepak, and Fluent), COMSOL, or equivalent, including nonlinear and transient analyses.
• Working knowledge of lab‑scale validation techniques.

• Experience with Ansys AEDT and Ansys Sherlock.
• Understanding of advanced semiconductor packaging, solder joints, and reliability modeling techniques.
• Knowledge of common optical system specifications and optical component specifications.
• Exposure to SOC thermal mechanical analysis.
• Exposure to optical structural analysis.

U.S. Base Pay Range: $100,000 – $145,000 USD
Bay Area Pay Range: $140,000 – $160,000 USD
Full‑time roles are eligible for equity and benefits. Base pay is only one part of the total compensation package and may vary based on qualifications and location.

Psi Quantum provides equal employment opportunity for all applicants and employees. Psi Quantum does not unlawfully discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by applicable laws.