Principal Characterization-Failure Analysis Engineer

Principal Characterization-Failure Analysis Engineer

The Principal Characterization-Failure Analysis Engineer will be responsible for thermomechanical characterization of sub-assembly and associated silicon dies, as well as carrying out failure analysis/debug activities on sub-assemblies. This role requires engineering expertise in mechanical, thermal, packaging, and package-processing disciplines. Having peripheral experience in photonics and electrical engineering will be a plus.

Responsibilities:

• Experienced problem-solver and able to diagnose failures using root cause analysis tools such as fishbone diagram, hypothesis table, and 8D approach.
• Experienced with failure mode and effects analysis (FMEA).
• Experienced in data processing tools such as Python, MATLAB, and JMP.
• Familiarity with back-end semiconductor assembly processes, testing methodologies, and equipment, including die attach, wire-bonding, and AOI.
• Exposure to photonics sub-assembly with experience in semiconductor packaging and inspection equipment, processes, and material systems (die attach, wire bonding, optical coupling, flip chip, underfill, etc.).
• Characterization experience in mechanical vibrations, thermography, and mechanical load testers.
• Demonstrated ability to manage short deadlines and to follow a disciplined work process. Able to work in a fast-paced environment.
• Good team worker and brings in a positive attitude and is always ready to help others.

Experience/Qualifications:

• Master's degree or higher in an applicable engineering discipline, such as Electrical Engineering, Mechanical Engineering, Optical Engineering or Applied Physics.
• 10+ years of experience applying engineering principles to debug complex failure analysis in opto-mechanical assembly process problems.
• Excellent written and verbal communication skills;
  Self-starter;
• Demonstrated strong analytical and problem-solving skills;
• Ability to provide technical leadership in ambiguous situations;

Note:
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The ranges below reflect the target ranges for a new hire base salary. One is for the Bay Area (within 50 miles of HQ, Palo Alto), the second one (if applicable) is for elsewhere in the US (beyond 50 miles of HQ, Palo Alto). If there is only one range, it is for the specific location of where the position will be located.

Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate's qualifications including relevant education and training, competencies, experience, geographic location, and business needs. Base pay is only one part of the total compensation package. Full time roles are eligible for equity and benefits. Base pay is subject to change and may be modified in the future.

U.S. Base Pay Range $165,000 —$200,000 USD Bay Area Pay Range $208,000 —$245,000 USD