Thin Film Manufacturing Engineer

Thin Film Manufacturing Engineer – Milpitas, CA

Full‑time position with a salary range of $121,000 to $160,000 per year.

Under the direction of the Director of Thin Film Manufacturing Engineering, the Thin Film Manufacturing Engineer monitors and supports thin film manufacturing processes, ensures reliability, verifies robustness, improves efficiency, implements cost‑saving practices, analyses data, and resolves root causes to enhance production yields.

• Monitor, sustain, and support day‑to‑day thin film manufacturing processes, programs, and activities.
• Ensure process reliability by providing technical support to operators, technicians, and engineers.
• Collaborate with the development team on new thin‑film process integration and manufacturing improvements.
• Improve the efficiency of deposition and/or dry‑etching processes by analysing data, conducting experiments, and researching alternative methods that reduce scrap.
• Design and conduct experiments to verify process robustness by characterising process latitudes.
• Develop and implement practices or methodologies that lower cost, reduce cycle time, and improve operational efficiency.
• Conduct root‑cause analysis and implement corrective action as required.
• Respond to inquiries from other team members, managers, or departments.
• Use Statistical Process Control (SPC) to analyse product quality data; develop charts or reports and present findings to groups or teams.
• Adhere to all safety policies and procedures as required.
• Perform other duties of a similar nature or level.

• Master's degree in Chemistry, Chemical or Electrical Engineering, Materials Science, Physics, or equivalent relevant experience (Ph.D. preferred).
• Three years of hands‑on experience in magnetic thin‑film fabrication or semiconductor manufacturing/process engineering.
• Hands‑on experience with SPC and Design of Experiments (DOE).
• Proficiency in Microsoft Office applications.

• Strong knowledge of magnetic thin‑film fabrication techniques using IBE/RIE/ALD and ion milling.
• Knowledge and experience of TMR, CPP GMR, spin‑transfer‑oscillator film processes.
• Familiarity with surface analytical/materials characterization techniques (XRD, AFM, TEM, SEM, FIB).
• Experience using JMP or Excel and ability to create macro formulas.
• Ability to use Microsoft Office to create spreadsheets, Word documents, and presentations.
• Design experiments, analyse results, and recommend corrective action.
• Communicate effectively, both verbally and in writing, with all levels of contractors, employees, and management.
• Work productively and collaboratively with all levels of employees and management.
• Comply with all safety policies and procedures.
• Use critical thinking to resolve issues, conduct root‑cause analysis, and recommend process improvements.
• Demonstrated critical thinking, analytical, organisational, time‑management, problem‑solving, and troubleshooting skills.
• Flexibility and ability to prioritise.

The Thin Film Manufacturing Engineer primarily works in an office environment Monday to Friday, may travel between buildings, and works in a class‑100 ESD‑sensitive wafer manufacturing facility wearing a cleanroom suit (hood, gloves, safety glasses, booties, mask). Exposure to hazardous conditions, chemicals, fumes, gases, loud noise, and the need to stand, walk, bend, twist, perform fine‑grasping movements, operate a computer and other office equipment is required.

Lifting up to 30 pounds occasionally may be required.

Annual salary range: $121,000–$160,000, plus bonus target and benefits. Pay may vary based on responsibilities, knowledge, skills, education, and experience.

TDK/Headway Technologies, Inc. provides equal employment opportunities to all employees and applicants without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation should contact the Headway Human Resources Department.