Principal Characterization-Failure Analysis Engineer

Job Summary

The Principal Characterization-Failure Analysis Engineer will be responsible for thermomechanical characterization of sub-assembly and associated silicon dies, as well as carrying out failure analysis/debug activities on sub-assemblies. This role requires engineering expertise in mechanical, thermal, packaging, and package-processing disciplines. Having peripheral experience in photonics and electrical engineering will be a plus.

• Experienced problem-solver and able to diagnose failures using root cause analysis tools such as fishbone diagram, hypothesis table, and 8D approach.
• Experienced with failure mode and effects analysis (FMEA).
• Experienced in data processing tools such as Python, MATLAB, and JMP.
• Familiarity with back-end semiconductor assembly processes, testing methodologies, and equipment, including die attach, wire-bonding, and AOI.
• Exposure to photonics sub-assembly with experience in semiconductor packaging and inspection equipment, processes, and material systems (die attach, wire bonding, optical coupling, flip chip, underfill, etc.).
• Characterization experience in mechanical vibrations, thermography, and mechanical load testers.
• Demonstrated ability to manage short deadlines and to follow a disciplined work process. Able to work in a fast-paced environment.
• Good team worker and brings in a positive attitude and is always ready to help others.

• Master's degree or higher in an applicable engineering discipline, such as Electrical Engineering, Mechanical Engineering, Optical Engineering or Applied Physics.
• 10+ years of experience applying engineering principles to debug complex failure analysis in opto-mechanical assembly process problems.
• Excellent written and verbal communication skills;
  Self-starter.
• Demonstrated strong analytical and problem‑solving skills.
• Ability to provide technical leadership in ambiguous situations.

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Base Salary Range: $165,000 - $200,000 USD (U.S.

- non-Bay Area). Bay Area Pay Range: $208,000 - $245,000 USD. Full‑time roles are eligible for equity and benefits. Base pay is subject to change and may be modified in the future.