Senior Process Engineer

Summary

The Senior Process Engineer will perform IC Assembly process development and improvement directly resulting in increased efficiency and quality on the production floor

• Assembly Engineering support for the Customer and Sales Group to review Customer requirements, and determine the correct process and materials to meet those requirements.
• Daily interaction directly with customers with regard to technical issues and specification reviews.
• Manage and define Assembly Processes relating to specific Products and/or Customers.
• Responsible for conducting thorough Design of Experiments on new IC Assembly Processes with the goal of developing processes and enhancing productivity.
• Provide DOE, SPC, and yield reporting in a clear and presentable format.
• Collect Assembly yield data and perform yield analysis for production equipment and customer products.
• Generate detailed reports and specifications documenting all experimental and process findings and procedures.
• Assess existing processes and identify areas of improvement and solutions for these systems.
• Evaluate and provide recommendations on new equipment that will enhance the current production capabilities.
• Conduct root cause analysis and corrective actions related to process failures.
• Identify and implement cost, quality, and yield improvements.
• Flexible to perform other duties as assigned.

Senior Process Engineer

General Manager

Assembly Engineering

Silicon Valley

The Senior Process Engineer will perform IC Assembly process development and improvement directly resulting in increased efficiency and quality on the production floor This will be achieved through process documentation, operator training, and design of experiments

• Assembly Engineering support for the Customer and Sales Group to review Customer requirements, and determine the correct process and materials to meet those requirements.
• Daily interaction directly with customers with regard to technical issues and specification reviews.
• Manage and define Assembly Processes relating to specific Products and/or Customers.
• Responsible for conducting thorough Design of Experiments on new IC Assembly Processes with the goal of developing processes and enhancing productivity.
• Provide DOE, SPC, and yield reporting in a clear and presentable format.
• Collect Assembly yield data and perform yield analysis for production equipment and customer products.
• Generate detailed reports and specifications documenting all experimental and process findings and procedures.
• Assess existing processes and identify areas of improvement and solutions for these systems.
• Evaluate and provide recommendations on new equipment that will enhance the current production capabilities.
• Conduct root cause analysis and corrective actions related to process failures.
• Identify and implement cost, quality, and yield improvements.
• Flexible to perform other duties as assigned.

• Perform or assist with any operations to maintain workflow, meet schedules and meet quality requirements.
• Maintain safe work areas, comply with safety procedures, and follow equipment operating rules.
• Follow clean room and other environmental precautions and procedures.
• Participate in meetings and work groups to facilitate cross functional activities, communicate issues, obtain approvals, resolve problems, and maintain knowledge of new developments, requirements, and policies.
• Comply with all quality and ITAR policies, practices, and procedures.
• Participate in team efforts to achieve departmental and company goals.
• Contribute to building a positive team spirit.
• Communicate effectively with all levels of employees.
• Protect confidential information by not communicating, disclosing, or using for benefit of 3rd parties.
• Maintain the highest degree of honesty and integrity at all times.
• Perform other related duties as assigned.

Bachelor’s Degree in Engineering, Electrical, Mechanical, Material Science, or related field preferred;

• Advanced understanding of Semiconductor processes.
• Hands-on Experience in Semiconductor Back End Process Engineering required.
• Hands-on Experience in wafer thinning, dicing, die-attach, flip chip, and wire bonding preferred

• 10 years of Assembly Process Engineering experience, preferred Hands on in Die Attach, Wire Bond or Mold
• Knowledge of basic AutoCAD or Solidworks preferred.
• Statistical…