Materials Scientist, Dual Beam Analysis

Company Description

Eurofins EAG Laboratories has over 40 years experience in engineering and materials testing services. Our parent company, Eurofins Scientific, is a multi‑billion‑dollar global leader in engineering and scientific services operating over 950 labs in 60 countries with 65,000 employees and a portfolio of over 200,000 validated analytical methods.

At EAG, curiosity fuels everything we do. Every analysis, every test, and every question asked in our labs helps unlock what materials and products are capable of—and what the world can build next. If you’re energized by materials science, analytical chemistry, engineering rigor, and solving problems that matter, you’ll feel right at home here.

Our scientists and engineers support industries ranging from semiconductors and advanced electronics to pharmaceuticals, medical devices, energy systems, and consumer products. Using advanced techniques in analytical chemistry, microscopy, surface analysis, and engineering sciences, we help clients solve complex challenges across the product lifecycle.

What sets EAG apart isn’t just our world‑class instrumentation—it’s our people. We’re problem solvers, collaborators, and lifelong learners who value precision, curiosity, and impact. Here, your work directly influences the safety, reliability, and performance of products used around the globe.

Imagine the possibilities. Let’s explore them together.

We're seeking a skilled Materials Scientist to join our dynamic Dual Beam Analysis team. The primary responsibility of this role is the preparation of high‑quality TEM lamella using advanced Dual Beam FIB/SEM systems for imaging and analysis of client samples. The position also involves performing SEM imaging and EDS analysis on FIB cross‑sections, supporting detailed structural, compositional, and failure analysis.

Additional responsibilities include critical dimension (CD) measurements, process optimization, and working closely with cross‑functional teams to deliver high‑quality, timely analytical results for a wide range of semiconductor and materials characterization projects.

The successful candidate will be a strong technical contributor who thrives in a fast‑paced lab environment, enjoys focused tool time, and values producing high‑quality, site‑specific results within defined client timelines.

• Support FIB/SEM operation, including TEM lamella preparation and FIB-SEM/EDS analysis
  .
• Develop and implement automation workflows on Dual Beam (FIB/SEM) systems for lamella prep, cross‑sectioning, and imaging.
• Maintain pipelines for FIB sample preparation
  , SEM imaging
  , and data acquisition.
• Perform image processing and analysis on 2D/3D FIB/SEM datasets.
• Improve throughput, repeatability, and data quality of Dual Beam services.
• Collaborate with cross‑functional teams to solve failure analysis and materials characterization challenges.
• Engage with a diverse customer base across multiple industries, providing technical consultation and guidance on analytical approaches and solutions.

Work Schedule:

5pm-2am, Tuesdays to Saturdays (Shift differential will apply)

This position supports work related to defense applications and is subject to ITAR regulations.

Applicants must be U.S. Persons, defined as:

• U.S. Permanent Resident (Green Card holder)
• Political Asylee or Refugee

• MS or PhD in Materials Science and Engineering or related field or equivalent industrial experience.
• Must have in‑depth knowledge of electron microscopy;
  Dual Beam (FIB/SEM) imaging.
• ExpertwithSEM/EDX, or TEM sample preparation.
• Solid understanding of semiconductor device physics and failure analysis (through previous work experience or coursework).
• Excellent communication skills (written, verbal and presentation).

• Experience with semiconductor chip products and wafer samples is a plus.

Compensation is aligned with market standards for the region and tailored to individual qualifications and experience.

• Ability to continuously operate a personal computer or lab equipment for extended periods of time (4 or more hours).
• Ability…