Advanced Packaging & Layout Design Engineer
Job in
Minneapolis, Hennepin County, Minnesota, 55431, USA
Listed on 2026-07-07
Listing for:
SkyWater Technology Foundry
Full Time
position Listed on 2026-07-07
Job specializations:
-
Engineering
Manufacturing Engineer, Systems Engineer, Electronics Engineer, Mechanical Engineer
Job Description & How to Apply Below
Sky Water Technology is looking for a hardworking, and passionate experienced Advanced Packaging and Layout Designer for our Florida Advanced Packaging site. In this role, you will lead design activities to support client products, support hardware such as custom die / bridges and test vehicles to establish Process Design Kits (PDK). Co-design methodology and design should be utilized to create an optimized final package structure based upon customer needs that include the full stack from die, interposer (organic / silicon), and laminate along with reliability support hardware.
Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.
Major Area of Accountability
Design and layout of advanced 2.5D/3D packages based on FOWLP, interposer, and other advanced heterogeneous integration technologies
Development and preparation of detailed drawings for customers, such as package outline drawings, and detailed drawings for IC packaging designs
Train customers on use of PDKs for their own designs and provide customer support, including trade-space analysis, schedule, cost, risk analysis.
Ensure robust manufacturable designs, while minimizing manufacturing costs and schedule, while ensuring high reliability and quality
Required Qualifications:
Education:
BS Engineering, MS/PhD preferred. Physics, Electrical Engineering, Materials Science or equivalent. A commensurate combination of degree and experience will be considered.
Experience and Skills:
12+ years of advanced package design and layout
Project Management skills and/or defined training a plus.
Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
Knowledge of wafer level package assembly and manufacturing processes
Advanced packaging Signal and Power Integrity design and analysis
Software experience in Cadence APD and/or Synopsys 3
DIC, Virtuoso or equivalent, AutoCAD, Siemens Calibre
Can work both independently and in cross-functional teams for problem solving.
US Citizenship
Required:
This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.
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