Stage 6 mois "Energie de collage pour nouveaux matériaux
Listed on 2026-07-04
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Engineering
Research Scientist, Materials Engineering
Location: Cascilla
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So far, the materials mainly used for direct bonding are silicon dioxide (SiO₂) and copper. In the development of our new products, other materials such as silicon nitride (SiN), silicon oxynitride (SiON), silicon oxycarbide nitride (SiCN) as well as different types of glass are being considered for 3D integration.
This internship aims to study the optimal bonding conditions of these materials, particularly to evaluate their adhesion energies as a function of different annealing temperatures. The analysis will focus on the physico-chemical characterization of interfaces, the measurement of bonding energy by suitable mechanical methods, and the impact of thermal parameters on the quality and reliability of assemblies.
These works will help define bonding processes adapted to the new materials, paving the way for a high-performance and reliable heterogeneous integration.
ST is proud to be certified among the 17 global "Global Top Employers 2025" and to be the first and only semiconductor company to receive this distinction. ST has been distinguished in this ranking thanks to its continuous improvement approach, notably standing out in ethics and integrity, sense and values, organization and change management, as well as its commercial strategy and performance.
In France, ST has also obtained the Happy Trainee 2025 label. We cultivate an inclusive and diverse work environment where discrimination has no place. Our ambition is to recruit and retain talents reflecting the richness of the societies in which we operate. We commit to equity in career development, professional opportunities, and remuneration. At ST, we encourage candidates who do not necessarily meet all the criteria to apply, because we believe in the richness of varied backgrounds and offer real opportunities for learning and growth.
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