Senior Photonics Engineer

We are seeking a Senior Optical Engineer specializing in Photonic IC (PIC) Packaging to play a critical leadership role in advancing next-generation photonic packaging solutions from concept through manufacturing execution.

In this position, you will serve as the technical lead and primary optical authority for a U.S.

-based engineering team while collaborating closely with international counterparts. The role blends deep hands‑on optical engineering, people leadership, and customer‑facing technical ownership.

You will drive innovation in chip‑to‑chip and fiber‑to‑chip optical coupling, improve system performance through simulation and design optimization, and ensure on‑time, high‑quality delivery of complex photonic packaging programs. This role also supports the startup and scale‑up of manufacturing operations, including equipment installation and process qualification.

• Lead technical discussions with customers, translating requirements into manufacturable photonic packaging solutions
• Act as the primary technical authority for photonic IC packaging programs in Montana facility
• Manage, mentor, and coordinate a multidisciplinary engineering team in an international, matrixed organization
• Collaborate closely with global engineering teams, project management, and technical sales support
• Drive chip‑to‑chip and fiber‑to‑chip optical coupling design, alignment strategies, and packaging architectures
• Perform and review optical simulations, performance analysis, and design trade studies
• Ensure on‑time and in‑quality execution of engineering and manufacturing projects
• Support facility startup activities, including installation, qualification, and operation of optical packaging and alignment equipment
• Contribute to continuous improvement efforts related to yield, robustness, and manufacturability

• Master’s degree in Optical Engineering, Photonics, Physics, Microsystems Engineering, or a related field
• 5+ years of hands‑on experience in packaging integrated electro‑optical or photonic IC systems
• 5+ years of experience in semiconductor or advanced IC packaging
• Proven experience leading and managing engineering teams across disciplines and locations
• Strong hands‑on background in micro‑optical system design, alignment, and assembly in a production or pilot‑line environment
• Working knowledge of mechanical, thermal, and electrical design impacts on optical system performance
• Experience setting up and operating automated or semi‑automated precision motion and alignment systems
• Ability to work directly with customers in technical support and solution‑definition roles
• Excellent technical communication, documentation, and analytical skills
• Highly self‑motivated problem solver who thrives in fast‑paced, international teams

• Project or technical program management experience
• Proficiency with optical and mechanical design software such as Zemax and Solid Works
• Familiarity with optical, mechanical, and semiconductor design standards and drawing practices
• Experience organizing and maintaining build records, process documentation, and bills of materials (BOMs)
• Background supporting the transition from R&D into manufacturing scale‑up
• Competitive compensation package
• Benefits include paid time off (PTO), health insurance, and 401(k) with company match
• Opportunity to take on significant technical and leadership ownership
• Long‑term growth potential within an advanced photonics manufacturing environment
• Collaboration with a highly skilled, international engineering team