Reliability​/FA Engineer

Job Title:

Staff Reliability/FA Engineer

Posting

Start Date:

1/20/26

Job Location(s):
Newbury Park

At Skyworks, you will find a fast‑paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking.

We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition

Job Description:

Skyworks is seeking a Staff Reliability/FA Engineer at our Newbury Park, CA location. In this role, you will lead advanced failure analysis across component, module, and system levels. This senior role provides strategic technical leadership, ensuring robust root cause identification and driving corrective actions that enhance product reliability and quality. Oversee complex laboratory investigations, develop innovative FA methodologies, and influence design‑for‑reliability practices.

Responsibilities include analyzing and reporting results to isolate electronic module and device‑level failures, recommending test methods and FA control procedures, and ensuring compliance with company, customer, and regulatory reliability objectives. The position demands proactive development of new analytical tools to identify potential issues early in product development, packaging, and processes. Findings will guide design and material changes to improve system reliability.

You may propose changes in design or formulation to improve system and/or process reliability based upon proven laboratory methods.

• Perform comprehensive FA investigations via data analysis and troubleshoot electronic components including semiconductor chips, surface mount components, printed circuit boards and wire‑bond and flip chip modules.
• Devise and execute parametric, RF, and system‑level testing, ensuring accurate fault isolation and root cause determination through application of engineering knowledge or coursework in digital CMOS and HBJT RF constructs and associated devices.
• Develop and implement new FA techniques.
• Provide expert guidance to design, quality, and test engineering teams, influencing design‑for‑reliability decisions.
• Mentor junior engineers and technicians, fostering technical growth and best practices.
• Drive cross‑functional initiatives to improve product robustness and accelerate resolution of critical failures.
• Prepare and deliver high‑level technical reports and recommendations to senior management and customers, ensuring alignment with business objectives and reliability standards.

• BS degree in Electrical or Computer Engineering with 8+ years of relevant experience, or MS degree with 6+ years in FA and reliability engineering.
• Demonstrated expertise in digital CMOS, RF device fundamentals, and advanced circuit analysis.
• Proven ability to lead complex investigations and develop innovative FA methodologies.
• Extensive experience with FA tools such as SEM, CSAM, X‑ray CT, IR/NIR microscopy, and wet/dry etching techniques.
• Strong proficiency in PCB and IC design tools and RF/parametric test equipment.
• Exceptional analytical, problem‑solving, and communication skills, with the ability to influence technical decisions and drive cross‑functional collaboration at senior levels.
• Proficiency in Microsoft Office software including Outlook, Word, Excel, and PowerPoint.
• Exceptional technical depth, leadership, and collaboration across cross‑functional teams to achieve reliability excellence and continuous improvement.

Desirable qualifications include prior knowledge or familiarity with failure analysis tools and techniques such as SEM (Scanning Electron Microscope) and FIB (Focused Ion Beam). Experience with digital and RF test equipment and measurements is highly valued. A solid understanding of Si and GaAs wafer processes—including wet/dry etching, photolithography, dielectric deposition and etching—is important, along with proficiency in mechanical polishing and sample preparation techniques.

Knowledge of IC packaging technologies,…