Senior Mechanical Engineer

Company

Qualcomm Technologies, Inc.

Engineering Group, Engineering Group >
Mechanical Engineering

Qualcomm is seeking a Senior Mechanical Engineer to join the Server Platform Engineering (SPE) team. This role focuses on the mechanical design of high-performance server rack and CPU test platforms. The successful candidate will contribute to the entire server rack product development lifecycle, from early concept and detailed design to prototype builds, ODM collaboration, and sustaining engineering.

• Design and develop mechanical server platforms supporting next-generation CPU and compute architectures.
• Own detailed mechanical design, including 3D CAD models, assemblies, and manufacturing drawings.
• Electromechanical chassis and rack design of server test and production platforms.
• Creating, documenting, sourcing, building, and sustaining mechanical server assembly BOMs.
• Coordinating/sourcing prototype and production plastic, sheet metal, die-cast, and CNC machined mechanical assembly components including housings, heatsinks, cables, fixtures, chassis, etc.
• Interface with vendors and manufacturing partners to ensure design for manufacturability and support timely build schedules.
• Communicate and collaborate effectively with dynamic multi-disciplinary teams in various geographical regions.
• Develop effective thermal, structural, and tolerance analyses of mechanical assemblies.
• Effectively communicate and collaborate with multi-disciplinary design and supply chain teams across various geographical regions.
• Work onsite minimum 5 days/week in the Qualcomm office in San Diego, CA.

• Bachelor's degree in Mechanical Engineering or related field and 2+ years of mechanical engineering or related work experience.
• Master's degree in Mechanical Engineering or related field and 1+ year of mechanical engineering or related work experience.
• PhD in Mechanical Engineering or related field.

• BSME or equivalent from accredited college.
• 3+ years of professional mechanical engineering experience.
• Proficiency with 3D CAD tools (CREO or equivalent).
• Experience designing CNC machined, sheet metal, die-cast, and injection-molded components.
• Working knowledge of mechanical documentation, tolerancing, and GD&T.
• Strong understanding of mechanical data-center hardware design fundamentals.
• 5+ years of 3D solid modeling design tools experience utilizing CREO, Solid Works, or equivalent platforms.
• 3+ years of design experience with plastic injection-molded, die cast, chassis sheet metal, and CNC machined parts.
• 3+ years of experience developing mechanical constraints for printed circuit board assemblies.
• 3+ years electro-mechanical design experience.
• Experience using 3D thermal analysis software like Flow Therm or Icepak.
• Experience with structural analysis FEA tools.
• Experience with tolerance stack analysis of complex assemblies.
• 2+ years of data-center chassis and rack design experience.
• Top-down solid modeling experience with 3D design databases.
• Design constraint (EMN file) transfer experience between 3D CAD and PCB electronic CAD designs.
• Test/assembly fixture design experience.
• Experience with PDM systems (Agile preferred) for BOM and project management.

Pay Range: $ - $. In addition to base salary, Qualcomm offers a competitive annual discretionary bonus program and opportunities for annual RSU grants. A comprehensive benefits package is designed to support employees at work, at home, and  more details on US benefits, please reference Qualcomm’s benefits information.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, Qualcomm is committed to providing an accessible process. For disability accommodations, contact disabilit or call the Qualcomm toll-free number.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.