Principal Engineer Firmware

Location: California

#We Are In  for jobs that impact everyone's life. What if your ideas could change the way the world connects, powers up, or thinks? As a Principal Engineer Firmware in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.

Are you in?

Your Role Key responsibilities in your new role Provide on-site and remote support for integration and bring-up at customer and partner locations: hands-on debug, measurement, and structured issue reproduction

Tune end-to-end performance with measurable goals—for example latency, through put, jitter, and deterministic behavior where the application requires itWork with sensor, actuator, and bridge connectivity patterns(including Ethernet and comparable industrial interfaces) to close gaps between datasheets, reference designs, and customer reality

Study hardware and software protocol documentation; produce implementation proposals, risk notes, and migration paths customers can adopt

Integrate Infineon smart actuators and sensors into customer reference platforms, validating assumptions with experiments and concise technical write-ups Partner with teams responsible for edge AI compute stacks so that data paths, drivers, and APIs match what autonomy and perception software expect

Where customers use robotics simulation or digital twins for validation, help align real hardware behavior with simulated assumptions(hand-offs to simulation-focused peers as needed)
Develop or adapt Python and C++ utilities for bring-up, data capture, regression checks, and customer demonstrations

Deliver technical presentations, demos, and focused training so customers can sustain what you help them build

Collaborate globally with experts and central functions; communicate requirements, gaps, and competitive observations clearly

Track technology trends in Physical AI, humanoid and industrial robotics, motor control, power electronics, and communications that affect customer architectures

Your Profile Qualifications and skills to help you succeed

Education:

Bachelor’s, Master’s, or PhD in Computer Science, Electrical Engineering, Robotics, Mathematics, Applied Mathematics, or comparable field—with a strong software focus

Experience:

5 to 8 years of professional experience in software, robotics, simulation, embedded systems, applications engineering, system integration, or related customer-facing technical roles—or 3 years of relevant experience with Master’s, or about 2 years with a PhD, in comparable domains

Solid Python and C++ for bring-up tools, integration code, or performance-sensitive components

Hands-on experience with embedded Linux or comparable edge environments, drivers, protocols, and basic hardware debug (scopes, logic analyzers, or equivalent collaboration with HW peers)
Familiarity with real-time and performance-aware design: latency, timing, bandwidth, and system-level trade-offs Understanding of sensors and actuators in motion and robotics contexts; comfort with motor control and power concepts at the system level

Exposure to robotics middleware (for example ROS2) or industrial field buses where customers use them Ability to work within MBSE-oriented customer programs: requirements and traceability, interface and architecture views,and related artifacts that drive integration and acceptance planning

Strong customer communication: structured updates, honest status, and calm escalation when risks emerge

Experience working in cross-functional and international teams; fluent professional English Willingness to travel to support customers (frequency depends on projects and policy)
Nice to have Hands-on use of SysML, MBSE repositories, or architecture modeling tools (commercial or open) in hardware–software or systems programs

Familiarity with robotics simulation tools such as Isaac Sim, Isaac Lab, or Omniverse when customers use them alongside hardware bring-up Background in functional safety, EMC, or thermal constraints as they affect edge deployments.

Prior semiconductor or tier-one automotive/industrial applications exposure

At Infineon…