Director, NPI Operations
Listed on 2026-07-01
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Engineering
Systems Engineer, Electrical Engineering, Manufacturing Engineer, Electronics Engineer
Director, NPI Operations
Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world's first 3D-stacked photonics engine, Passage™, capable of connecting thousands to millions of processors at the speed of light in extreme-scale data centers for the most advanced AI and HPC workloads.
Lightmatter raised $400 million in its Series D round, reaching a valuation of $4.4 billion. We will continue to accelerate the development of data center photonics and grow every department at Lightmatter!
If you're passionate about tackling complex challenges, making an impact, and being an expert in your craft, join our team of brilliant scientists, engineers, and accomplished industry leaders.
Lightmatter is (re) inventing the future of computing with light!
We are seeking a strategic and hands-on Director of NPI (New Product Introduction) Operations, who will lead the transition of our next-generation hardware products from design completion through mass production. You will serve as the strategic bridge between Engineering, Product, and the Global Supply Chain, ensuring that revolutionary technology is manufacturable, scalable, and delivered with uncompromising quality to our data center partners.
Responsibilities:Product Lifecycle Leadership
- Lead the cross-functional NPI Core Team to ensure Design for Manufacturing (DFM) and Design for Test (DFT) requirements, specifically related to optical assembly and hybrid integration, are integrated early in the product design phase.
- Drive the Stage-Gate process from Proto to EVT (Engineering Validation), DVT (Design Validation), and PVT (Production Validation), with a focus on critical 3D CPO and laser manufacturing steps.
Supplier & Partner Readiness
- Partner with Strategic Sourcing to identify and qualify specialized OSAT partners with expertise in Silicon Photonics packaging (e.g., fiber attach, lidding), wafer-level processing, and active/passive optical alignment.
- Manage high-tech component vendors (e.g., DFB lasers, specialized optical substrates) and high-level relationships with Tier 1 manufacturers to ensure capacity and capability align with the product roadmap.
Yield & Ramp Management
- Own the "Ramp to Volume" strategy, identifying manufacturing bottlenecks in the pilot line, specifically related to laser burn-in and optical coupling, and implementing solutions to ensure a smooth transition to High-Volume Manufacturing (HVM).
- Monitor and report on First Pass Yield (FPY) focusing on end-of-line electro-optical performance metrics, and drive continuous improvement initiatives for wafer-level yield and module assembly yield.
Schedule & Risk Mitigation
- Develop and own the Master NPI Schedule, factoring in long-lead times for specialized foundry runs (e.g., Silicon Photonics wafers) and custom laser components.
- Proactively identify supply chain risks (e.g., single-source long-lead materials for CPO substrates or specialized laser drivers) and develop robust contingency plans, including alternate sourcing strategies for key optical components.
Financial Oversight
- Manage the Bill of Materials (BOM) cost targets through the development lifecycle, focusing on cost reduction.
- Ensure products meet aggressive margin targets required for global deployment at the point of launch.
- BS in Mechanical, Electrical, or Systems Engineering, or a relevant field.
- 10+ years of experience in Hardware Operations or NPI, specifically within the semiconductor, networking, or High-Performance Computing (HPC) industries.
- Deep understanding of semiconductor fabrication, advanced packaging (2.5D/3D), or optical assembly.
- Proven track record of managing cross-functional teams and external manufacturing partners in a high-growth, fast-paced environment.
- An MBA or MS in Supply Chain/Operations is a significant plus.
- Direct experience managing supply chains for silicon photonics, co-packaged optics (CPO), or highly complex advanced packaging (e.g., TSVs, interposers, wafer-on-wafer).
- Experience building supply chains for AI hardware accelerators, HPC clusters, or enterprise datacenter…
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