Package Layout Architect (2.5D/3D) — Equity
Job in
Mountain View, Santa Clara County, California, 94039, USA
Listed on 2026-08-12
Listing for:
DensityAI, Inc.
Full Time
position Listed on 2026-08-12
Job specializations:
-
Engineering
Electronics Engineer, CAD/ AutoCAD/ Mechanical Design, Hardware Engineer
Job Description & How to Apply Below
DensityAI, Inc. is seeking an experienced package layout engineer to own substrate and interposer layout end-to-end in Mountain View, CA. You will drive 2.5D/3D packaging, co-design with architecture, and coordinate with OSATs to release designs from bump map to tapeout.
You should have 8+ years in high-performance package layout, hands-on with Cadence Allegro and Xpedition tool flows, and a track record of delivering complex interposer-based layouts. Visa sponsorship available.
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