Physical Design Engineer
Listed on 2026-09-14
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Engineering
Hardware Engineer, Systems Engineer, Electronics Engineer
I’m working with an AI compute startup rebuilding the hardware and software stack around extreme compute density.
The team is developing a tightly integrated platform spanning advanced silicon, packaging, firmware, compilers, kernels, and infrastructure. This is broader than a conventional accelerator project, with physical-design decisions directly affecting the architecture and performance of the complete system.
This role will own physical design for one or more blocks of a new AI accelerator, from initial floor planning through final sign-off.
You’ll work on problems such as:
- Owning synthesis, floor planning, placement, routing, CTS, and sign-off
- Closing timing, power, area, congestion, and physical-verification requirements
- Developing AI-assisted flows to accelerate physical-design and sign-off timelines
- Working with architects and RTL designers to resolve implementation trade-offs
- Collaborating with EDA vendors, foundries, packaging, and verification teams
- Delivering complex blocks through tape-out and first silicon.
Looking for engineers who have:
- 8+ years of hands-on physical-design experience
- Experience with high-performance designs at 7nm or below
- Full-flow ownership from synthesis and floor planning through sign-off
- Strong experience with Cadence Innovus, Synopsys Fusion Compiler, or equivalent
- Hands-on timing sign-off experience using Prime Time, Tempus, or equivalent
- Experience working closely with architecture, RTL, foundry, and EDA teams
- A track record of taking complex silicon through tape-out.
Nice to have:
- CoWoS, chiplet, 2.5D, or 3D packaging experience
- Thermal, IR-drop, electromigration, or signal-integrity sign-off
- Experience with AI accelerators, CPUs, GPUs, or other high-performance compute silicon
- Experience building or improving physical-design automation.
This is an opportunity to own foundational implementation decisions for a new AI computing platform alongside engineers with experience across advanced CPUs, custom AI silicon, and wafer-scale systems.
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