EE - HW Design​/Looking for more responsibility

S. New Hampshire developer of cooled thermal imaging (IR) cameras for security, surveillance & DoD applications needs a Hardware Design/New Product Intro Engineer for full lifecycle design, development & introduction to production

This is perfect for someone with 3-5 years of exp. that is ready to take on more responsibility

Initial circuit design (75% digital/25% analog) to prototype bring-up & transition to production.

FPGA-based image processing, motorized lens control, power & system I/O.

• Circuit design & analysis:
  Analog, digital, mixed-signal, and power circuits
• PCB layout (Altium Designer) from component selection to DRC-clean, manufacturable boards.
• Support intro of new products to production; DFM/DFT reviews, pilot builds, yield improvement, and resolution of production-floor issues.
• Work with vendors on PCB fab/prototype assembly; quotes, data packages; quality issues
• SMT/Thru-hole soldering, rework, and modification of prototype assemblies.
• Integration & testing of detector electronics, zoom lens control, video output (HD-SDI / IP), and serial command interfaces (RS-232/422).
• Author test/design verification/product documentation.

• BS EE/CE with 3-7 years of electronic hardware design.
• Analog/digital circuitry; interfaces (I2C, SPI, UART, USB, Ethernet); power supply design basics.
• Schematic capture & PCB layout (Altium Designer/KiCad/OrCAD/Mentor).
• Self-motivated, detail-oriented; manage concurrent tasks in a small-team environment.
• Able to access ITAR/EAR information

• Visual ERP/comparable ERP/MRP system for BOM mgt, part creation & eng’g. change control
• FPGA design: (Xilinx Vivado, Intel Quartus, or similar); HDL (VHDL or System Verilog) is a plus.
• Scripting/programming (Python, C, MATLAB, Bash, or Power Shell) for test automation, data analysis, lab instrument control, and embedded debug is also a plus.
• Exposure to imaging systems, cameras, video interfaces (HD-SDI, MIPI CSI-2, Camera Link, GigE Vision), or infrared / electro-optical sensor systems.
• High-speed digital design, signal integrity, controlled-impedance routing, or serial interfaces.
• Exposure to embedded firmware, microcontroller bring-up, or board support package debug.
• IPC standards (IPC-A-610, J-STD-001) and design-for-manufacturing best practices.
• Have taken a product from prototype to volume production (ideally ruggedized hardware.

Candidates MUST be US Permanent Residents or Citizens (No exceptions)