Microelectronics​/Semiconductor Packaging Co-Op

Job Title:

Microelectronics / Semiconductor Packaging Co-Op Posting

Start Date:

9/14/26 Job Location(s):
Nashua

Requisition

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution.

Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

We are seeking a motivated Microelectronics/Semiconductor Packaging Co-Op/Intern to support the development of advanced microelectronic packaging technologies. This role provides hands‑on experience in semiconductor packaging, materials evaluation, process development, failure analysis, and engineering data analysis.

The selected candidate will work closely with packaging, manufacturing, quality, and design engineers, as well as external assembly partners, to help develop and optimize packaging solutions for high-performance electronic products.

This is for a Winter/Spring Coop from January 2027 - June 2027. Must have the ability to complete 6 month Co-Op term prior to graduation

• Support microelectronics packaging development and manufacturing projects.
• Evaluate and characterize packaging materials, including adhesives, mold compounds, substrates, underfills, and thermal interface materials.
• Assist with package assembly process development, optimization, and documentation.
  
  Conduct laboratory experiments and engineering studies to support product and process improvements.
• Collect, analyze, and present technical data to support engineering decisions.
• Assist with failure analysis investigations and root cause identification.
  
  Support Design of Experiments (DOE) activities and prepare technical reports and presentations.
• Create and maintain engineering documentation, test plans, specifications, and work instructions.
• Collaborate with cross-functional teams and external OSAT (Outsourced Semiconductor Assembly and Test) partners.
• Maintain accurate engineering records and adhere to laboratory safety requirements.

• Pursuing a Bachelor's or Master's degree in Mechanical Engineering, Chemical Engineering, Materials Science Engineering, Industrial Engineering, Electrical Engineering, or Electronics and Computer Engineering.
• Junior or Senior standing, or current graduate student.
• Strong analytical, problem‑solving, and communication skills.
• Proficiency with Microsoft Office applications, particularly Excel, Word, and PowerPoint.
• Ability to work independently and collaboratively in a team environment.

• Basic knowledge of semiconductor packaging, materials characterization, manufacturing processes, or failure analysis.
• Familiarity with statistical analysis, DOE methodologies, or data analysis tools such as Minitab, JMP, MATLAB, or Python.
• Experience with CAD tools such as Solid Works, Creo, or AutoCAD.
• Interest in semiconductor manufacturing and global supplier collaboration.

• Hands‑on experience with advanced semiconductor packaging technologies and manufacturing processes.
• Exposure to cross‑functional product development and supplier collaboration.
• Opportunities to develop technical, analytical, and project management…