Doctoral student in thermal packaging solutions communication and sensor systems

Doctoral Student In Thermal Packaging Solutions For Future Communication And Sensor Systems

Are you excited about shaping the next generation of wireless communication and sensing technologies? As a PhD student at Chalmers, you will conduct cutting-edge research in thermal design, advanced semiconductor technologies, and innovative packaging solutions for high-performance RF and mmWave systems.

At the Microwave Electronics Laboratory, we focus on application driven research on high-speed electronic components, circuits and systems for future communication and remote sensing applications. The research spans frequencies from below 1 GHz to 500 GHz. Our main research areas are within wireless high speed digital communication, sensors such as radar systems and radiometers, and microwave heating. We demonstrate innovative microwave components and circuits in our own fabrication lab, the Nanofabrication Laboratory at MC2, or at external cooperation partners/foundries.

We characterize our components and circuits in our measurement laboratory.

Future wireless communication, radar, and sensing systems require electronics that deliver higher power, greater energy efficiency, and increased integration. This project focuses on developing advanced thermal packaging solutions for GaN-based RF and mmWave electronics, where heat management is critical for performance and reliability. The research combines thermal characterization, modeling, microwave design, and additive manufacturing to create innovative packaging concepts that integrate both thermal and electromagnetic functions in compact, high-performance systems.

We are looking for a self-driven and highly motivated PhD candidate with a strong interest in solving system-level engineering challenges. The ideal candidate enjoys working across disciplinary boundaries at the intersection of electronics, physics, thermal engineering, and advanced materials, and is eager to contribute to the development of next-generation wireless communication and sensing systems.

• To qualify as a Doctoral student, you must hold a Master's degree (120 ECTS) or equivalent in Electrical Engineering, Engineering Physics, Mechanical Engineering, Materials Engineering, or a closely related field. For applicants with an education earned outside Sweden, a four-year Bachelor's degree may be considered equivalent.
• A strong interest in electronics, semiconductor devices, heat transfer, thermal management, and/or computational modeling.
• Strong analytical and problem-solving skills, with the ability to understand and address complex engineering challenges.
• Ability and motivation to work both experimentally and theoretically, combining simulations, measurements, and data analysis.
• Excellent written and verbal communication skills in English.

* for students with an education earned outside of Sweden, a 4-year Bachelor's degree is accepted.

Personal qualities are of great importance for this position. We are looking for a curious and ambitious candidate who enjoys learning new skills and tackling multidisciplinary research challenges. You should be able to work independently, take initiative, and contribute effectively to collaborative projects involving colleagues, industrial partners, and international research teams. A structured approach to research, strong communication skills, and the ability to translate scientific findings into practical engineering solutions are highly valued.

• Experience with thermal modeling and simulation tools such as COMSOL Multiphysics, ANSYS, CFD software, or equivalent.
• Experience in RF, microwave, or mmWave engineering.
• Experience with measurement techniques, laboratory work, and experimental characterization of electronic devices or systems.
• Programming experience in MATLAB, Python, or similar scientific computing environments.
• Knowledge of semiconductor devices, electronic packaging, reliability analysis, or heat transfer.
• Experience with additive manufacturing, advanced materials, or multiphysics simulations.
• Previou…