Profit Center Manager, Printed Circuit Board Assembly
Job in
New Haven, New Haven County, Connecticut, 06540, USA
Listed on 2026-07-31
Listing for:
Jobtailor
Full Time
position Listed on 2026-07-31
Job specializations:
-
Engineering
Manufacturing Engineer, Quality Engineering, Process Engineer -
Manufacturing / Production
Manufacturing Engineer, Quality Engineering
Job Description & How to Apply Below
- Develop and implement tooling, processes, documentation, and instructions for PCBAs.
- Conduct Design of Experiments (DOE), Process Failure Mode and Effects Analysis (PFMEA), and other methodologies to improve processes and quality.
- Configure Bill of Materials (BOMs) and routings for Printed Circuit Board Assemblies (PCBA)/systems in accordance with product structures, standards, and internal procedures.
- Demonstrate strong knowledge of stencil design, solder paste characteristics, stencil printing, pick and place, and solder reflow processes.
- Determine root causes of PCBA defects and implement necessary changes.
- Continuously review assembly operations for accuracy, proper manufacturing methods, and optimization of manufacturing processes.
- Participate in and lead New Product Introduction (NPI) activities for all electronic assemblies.
- Order equipment, tools, and instruments for new processes.
- Bachelor of Science in Manufacturing Engineering, Industrial Engineering or related field of study.
- Must have a minimum of 5 years of Surface Mount Technology (SMT) or PCBA development experience.
- Lean Manufacturing experience is required.
- Strong background in Surface Mount Technology (SMT) processes and process development, with the ability to serve as a technical expert.
- Proven ability to lead improvements in process yield, quality, cycle time, inventory accuracy, and delivery.
- Proficiency in Surface Mount Technology (SMT) equipment programming and troubleshooting, including placement equipment, Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), printing, and reflow ovens.
- Proficient in Microsoft Office Suite (Word, Excel, PowerPoint, Access, Outlook).
Demonstrates expertise in Surface Mount Technology (SMT) processes and development, with a strong focus on improving process yield, quality, and efficiency in PCB assembly. Proficient in leading New Product Introduction (NPI) activities and optimizing manufacturing processes through effective tooling and documentation.
Highest-signal resume keywords- Surface Mount Technology (SMT) Development
- Process Failure Mode and Effects Analysis (PFMEA)
- Design of Experiments (DOE)
- Lean Manufacturing
- New Product Introduction (NPI)
- Surface Mount Technology (SMT) Processes
- Process Development
- Root Cause Analysis
- Bill of Materials (BOM) Configuration
- Stencil Design
- Solder Paste Characteristics
- Solder Reflow Processes
- Manufacturing Process Optimization
- Equipment Programming and Troubleshooting
- Quality Improvement
- Printed Circuit Board Assemblies (PCBA)
- Manufacturing Engineering
- Industrial Engineering
- Assembly Operations
- Process Yield
- Cycle Time
- Inventory Accuracy
- Delivery
- Microsoft Office Suite
- Solder Paste Inspection (SPI)
- Automated Optical Inspection (AOI)
- Reflow Ovens
- Placement Equipment
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