Engineer , Mechanical; Electronics Packaging

Position: Engineer I, Mechanical (Electronics Packaging)
Location: Parsippany

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Mechanical Engineer I (Electronics Packaging)

Power & Actuation Systems

Overview

The Electronics Packaging Mechanical Engineer is responsible for the physical design and construction of ruggedized electronics and ruggedized electronics enclosures. The Engineer is responsible for designing products to meet customer's requirements (including all design, functional, material, and test requirements from the customer's component and sub-tier specifications) as well as the cost targets established during the proposal stage. The specific assignments and responsibilities will be consistent with the level of experience of the engineer.

Regular interaction with engineers and test technicians as well as frequent contact with suppliers, contractors, and customers. Occasional light travel may be involved.

Minimum

Required Qualifications

* B.S. in Mechanical Engineering is required (Advanced technical degree desirable).

* 0-5 years design experience (electronics packaging expertise preferred).

* Ability to solve complex mechanical static & dynamic problems.

* Works precisely, accurately, and pays close attention to all details.

* High level of mechanical aptitude and knowledge.

* Experience in 3D CAD solid modeling and understanding of mechanical design principle (Experience with PTC CREO desirable)

* Excellent verbal/written communication skills required for multi-faceted interactions with all levels of personnel within the organization, as well as all outside agents, including but not limited to, vendors, suppliers, customers, potential job candidates, etc.

* Highly computer literate, with MS Office/PC expertise, and demonstrated experience with applicable systems, programs, equipment, etc.

* Ability to prioritize and manage multiple tasks simultaneously.

* Must be a US Citizen

Preferred Qualifications

* Design experience with electronic packaging approaches for defense and aerospace applications preferred including:

* Design for high shock and high vibration environments

* Design for challenging thermal conditions

* Innovative techniques for cooling electronics in a high-temperature environment (e.g. phase-change approaches).

* Knowledge of IPC, WHMA, and NASA specifications for Printed Wiring Boards (PWBs), Circuit Card Assemblies (CCAs), wiring harnesses, and soldering.

* Knowledge of high voltage / altitude design practices at the board and box-level.

* Knowledge of environmental testing per MIL-STD-810, DO-160 or similar.

* Experience with design for manufacturability

* Knowledge of machining operations, brazing, and additive manufacturing.

* Knowledge of PWB and CCA fabrication

* Exposure to performing analytical solutions to structural and thermal design problems using closed-form, ANSYS, ABAQUS, and/or CREO Simulate.

Essential or Primary /

Key Responsibilities:

* Support the engineering design and development of ruggedized electronics and electronics enclosures to meet customer requirements through all phases of product life cycle. Typical tasks include:

* Preliminary CAD design of electronics / electronics enclosures

* Interface with electrical engineers to establish sizing of circuit card assemblies and selection of materials.

* Ensure accuracy of all relevant drawings/documents on the project, except purely drafting technique issues. This includes tolerance stack-ups.

* Coordinate the creation of a preliminary bill of material in the business system and verifying its accuracy.

* Support / Review preliminary analytical results (Hand calcs and/or FEA)

* Communicate technical and schedule problems, in a timely manner, to Engineering Manager /…