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Manager, Mechanical Engineering - Electronics Packaging

Job in Parsippany, Morris County, New Jersey, 07054, USA
Listing for: Marotta Controls
Full Time position
Listed on 2026-07-01
Job specializations:
  • Engineering
    Mechanical Engineer, Systems Engineer, Manufacturing Engineer
Job Description & How to Apply Below
Location: Parsippany

Manager, Mechanical Engineering – Electronics Packaging Design (PAS)

Elevate your career at Marotta Controls, a New Jersey Top Workplace three years running! Dedicated to innovation, quality and excellence, we deliver cutting edge control systems for the Aerospace & Defense industry. At Marotta, we value bold thinking and teamwork, and we empower our employees to push boundaries while delivering top-tier solutions to our customers. Our team fosters a fun, collaborative culture where creativity and technical excellence thrive!

Your next big opportunity starts here. Be part of a company where your work supports a mission that makes a difference—apply today!

Job Summary Of The Position

The Engineering Manager leads day-to-day execution of mechanical design activities supporting ruggedized electronics packaging within the PAS business unit. This role is responsible for team management, program-level execution, and adherence to established Marotta-internal structural, thermal, vibration, EMI/EMC, and IPC Class 3 design standards. Additionally, this role participates in the development and maintenance of mechanical engineering procedures, reference manuals, and design standards.

Reports to:

Director, Mechanical Engineering, PAS.

Scope Of Responsibility:

  • Direct management of 10+ mechanical engineers.
  • Program-level electronics packaging design execution accountability.
  • Enforcement of established design standards and margin policies.
  • Support of design, integration, and qualification activities under Senior Manager/Director oversight.

Engineering & Technical Leadership:

  • Assign and manage packaging-engineering design tasks and resources.
  • Ensure design compliance with customer/ contractual performance requirements.
  • Oversee execution of thermal, structural, and vibration/shock analysis.
  • Oversee ruggedized electronics design (Thermal, structural, CCA, PCB, DFM, etc.).
  • Ensure IPC Class 3 mechanical integration practices.
  • Ensure EMI shielding and grounding implementation as appropriate.
  • Ensure application of environmental sealing techniques as appropriate.
  • Drive disciplined execution through gated reviews (SRR, PDR, CDR, TRR, FCA/PCA).
  • Participate and drive closure in failure investigation, root cause analysis, and corrective action (FRACAS) activities.
  • Support proposal efforts with credible technical, labor, and schedule inputs and risk assessments.
  • Maintain AS9100 compliance and audit readiness within the mechanical discipline.
  • Spearhead electronic packaging-related issue resolution.
  • Escalate systemic risks appropriately.

Process & Standardization:

  • Enforce mechanical engineering procedures and documentation controls.
  • Ensure AS9100 compliance at team level.
  • Institutionalize lessons learned into formal design guidance.
  • Improve repeatability, documentation quality, and configuration control discipline.
  • Ensure analysis assumptions and modeling practices are standardized and traceable.
  • Additionally, Participate in development, maintenance, and enforcement of:
    • i. Mechanical engineering procedures and work instructions
    • ii. Electronics packaging design standards
    • iii. Engineering design reference manuals
    • iv. Design review checklists and documentation controls

Team Development:

  • Conduct performance reviews and development planning.
  • Mentor and develop mechanical engineers in technical rigor and execution discipline.
  • Provide clear performance expectations and structured feedback.
  • Foster cross-functional collaboration.

Required Qualifications:

  • Bachelor's degree in Mechanical, Aerospace, or related discipline.
  • 8+ years aerospace/defense experience.
  • 3+ years leadership/management experience preferred.
  • Demonstrated experience designing electronics packaging for harsh environments (vibration, shock, thermal cycling).
  • Experience with structural, vibration, and shock design.
  • Experience with thermal management design (conduction, convection, radiation cooling methods).
  • Working knowledge of IPC Class 3 requirements for CCA/PCB design and manufacturability.
  • Familiarity with EMI shielding, grounding, and environmental sealing techniques.
  • Familiarity with connector selection for aerospace applications.
  • Working knowledge of thermal, structural, and vibration analysis principles; familiarity with FEA tools.
  • Proficiency with 3D CAD systems (PTC Creo preferred).
  • Working knowledge of environmental qualification standards (MIL-STD-810, MIL-STD-461, DO-160, etc.).
  • Strong written and verbal communication skills.
  • Must be a U.S. citizen.

Preferred Qualifications:

  • Master's degree in Mechanical, Aerospace, or related engineering discipline.
  • Direct experience with flight-critical control actuation systems and power systems.
  • Experience leading programs through environmental qualification and production release.
  • Active, or eligible for, U.S. security clearance.

What Success Looks Like:

  • Electronic assembly designs meet cost, schedule, and technical commitments.
  • Strong customer confidence and successful qualification outcomes.
  • Late-stage test failures and electronics-packaging-related rework are reduced.
  • Engineering…
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