Quantum Signal Integrity and Mechanical Packaging Scientist​/Engineer

Overview

At IBM Research, we are the innovation engine of IBM. Exploring what’s next in computing and shaping the technologies the world will rely on tomorrow. From advancing AI and hybrid cloud to pioneering practical quantum computing, we anticipate challenges and unlock new opportunities for clients, partners, and society. Working in Research means joining a team that accelerates discovery at the intersection of high-performance computing, AI, quantum, and cloud.

You’ll collaborate with leading scientists, engineers, and visionaries to push boundaries and turn ideas into reality. With a culture built on curiosity, creativity, and collaboration, IBM Research offers the opportunity to grow your career while contributing to breakthroughs that transform industries and change the world.

This role would help enable IBM to scale up our quantum processors while maintaining leading signal integrity, shielding and reliability of the overall system. The ideal candidate would have outstanding communication skills and be able to speak to physicists, engineers and technicians to help solve the challenges encountered when scaling up superconducting quantum processors to the sizes needed for fault tolerant quantum computing.

Preferred Education
Doctorate Degree

• Masters in physics, electrical engineering or related field
• 2 years working with cryogenic microwave signal delivery or equivalent
• Experience with dilution fridges or other 4K systems capable of reaching temperatures needed for superconducting materials
• Demonstrated communication ability by writing journal articles, thesis and giving live presentations
• Demonstrated experience with mechanical electrical assemblies

• Simulation experience in HFSS or other microwave software
• PhD in physics, electrical engineering or related field
• 4 years working in a superconducting electronics laboratory
• Working with qubits and taking measurements such as T1, T2, and crosstalk
• Mechanical design experience with complex assemblies and dealing with CTE mismatch