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Quantum Superconducting Materials Engineer

Job in New York, New York County, New York, 10261, USA
Listing for: GLOBALFOUNDRIES US Inc.
Full Time position
Listed on 2026-06-02
Job specializations:
  • Engineering
    Materials Engineer, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 60000 - 80000 USD Yearly USD 60000.00 80000.00 YEAR
Job Description & How to Apply Below
Location: New York

Overview

Global Foundries Fab8 is seeking an experienced R&D cryogenic / superconducting materials engineer to join the Quantum Advanced Packaging team. The primary responsibility is to own development, selection, and integration of cryogenic and superconducting materials enabling high-performance, scalable quantum packaging technologies from concept through manufacturing.

Responsibilities
  • Lead selection and development of materials systems for cryogenic and superconducting packaging, including: superconducting metals (Nb, Al, NbN, etc.), interconnect materials (In, Cu, Sn-based systems), dielectric, substrate, and bonding interface materials.
  • Establish material schemes compatible with millikelvin–cryogenic operating environments.
  • Evaluate material suitability for electrical conductivity / superconductivity; thermal conductivity / isolation; and mechanical robustness under cryogenic cycling.
  • Drive integration of materials into 2D, 2.5D, and 3D advanced packaging architectures; define material stacks and interfaces across BEOL / RDL layers, interposers, TSVs, bump and bonding interfaces.
  • Ensure compatibility of materials with process flows, tools, and downstream assembly operations; own materials-related process integration from early development through prototyping and qualification.
  • Drive process development, optimization, and control plans for deposition, plating, bonding, and surface preparation; enable movement of prototypes and development lots across fab and assembly workflows.
  • Develop deep understanding of temperature-dependent material properties including superconducting transitions, electrical resistivity and RF loss, thermal transport behavior, and mechanical stress/CTE mismatch.
  • Define and utilize characterization methods (electrical, thermal, structural) to evaluate materials performance; correlate material behavior with device- and system-level performance.
  • Identify and analyze failure mechanisms (delamination and interface failure; diffusion / intermetallic formation; stress-induced cracking during thermal cycling); develop material solutions and process mitigations to enhance reliability; drive long-term reliability strategies for cryogenic operation.
  • Develop materials solutions that improve yield and process robustness; reduce cycle time and cost.
  • Partner with integration teams to ensure scalable and manufacturable material choices; work with suppliers and equipment vendors to evaluate new materials and define material specifications and qualifications.
  • Collaborate with OSATs and partners to enable wafer-level and die-level integration flows; interface across interconnect / bump / TSV / assembly teams and device / qubit / system engineering teams; enable co-optimization of materials + process + system architecture.
  • Drive development of next-generation materials for scalable quantum systems, including superconducting interconnect stacks and cryogenic-compatible dielectrics and bonding materials.
  • Contribute to APPC quantum packaging roadmap and capability build-out; track and evaluate emerging materials and integration schemes.
  • Generate material specifications and process guidelines; integration documentation and characterization reports; communicate results to internal and external stakeholders; support IP generation, publications, and conference outputs.
  • Define materials strategy across multiple quantum platforms and customers; lead external technical engagements (e.g., R&D consortia, suppliers, quantum customers).
  • Mentor engineers and establish materials selection frameworks and best practices.
Qualifications
  • Education – Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program; MS degree with at least 15 years of related work experience; minimum 3.0 GPA.
  • Language Fluency – English (written and verbal).
  • Travel – Up to 20%.
Preferred Qualifications
  • Education – PhD with at least 12 years of related work experience.
  • Demonstrated leadership experience; project management skills; ability to navigate ambiguity; strong written and verbal communication; strong planning and organizational skills.

Other information:
Global Foundries is an equal opportunity employer.

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