Back Grind​/Back Metal Post Fab Engineer

Location: Hopewell Junction

** onsemi
* * is seeking a highly motivated engineer to work in our Technology Development group as a Process Integrator focused on wafer thinning and backmetal development on new CMOS, BCD, Image Sensor, and other new/novel technologies.  This will include driving continuous improvement on new processes, new product architecture and technologies, Yield and Performance improvements, and New Product/Technology Introduction and ramp to volume manufacturing.

** onsemi**  (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

** More details about our company benefits can be found here:*
* We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

** onsemi
* * is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws.

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