Hardware Developer

Introduction

At IBM Research, we are the innovation engine of IBM. Exploring what’s next in computing and shaping the technologies the world will rely on tomorrow. From advancing AI and hybrid cloud to pioneering practical quantum computing, we anticipate challenges and unlock new opportunities for clients, partners, and society. Working in Research means joining a team that accelerates discovery at the intersection of high-performance computing, AI, quantum, and cloud.

You’ll collaborate with leading scientists, engineers, and visionaries to push boundaries and turn ideas into reality. With a culture built on curiosity, creativity, and collaboration, IBM Research offers the opportunity to grow your career while contributing to breakthroughs that transform industries and change the world.

As a Unit Process Engineering Professional, you will manage complex semiconductor fabrication processes and procedures in various areas, including Ion Implant, RTP, GS or Selective Dry Etch.

You will also oversee the transfer and application of new processes, procedures, and technologies from research and development into production.

Your primary responsibilities will include:

• Manage Fabrication Processes:
  Manage complex semiconductor fabrication processes and procedures, ensuring consistent manufacturing processes.
• Analyze and Improve Yield:
  Perform yield improvement activities across all wafer fabrication processes through the use of automated inspection metrology and data analysis, identifying opportunities for optimization.
• Oversee Equipment Maintenance:
  Oversee the installation, maintenance, and repair of semiconductor fabrication equipment, ensuring minimal downtime and optimal performance.
• Collaborate on Optimizations:
  Lead and drive optimizations in partnership with cross-functional engineering teams to facilitate and streamline manufacturing control systems.
• Analyze Manufacturing Systems:
  Perform manufacturing systems analysis and improvement, including cycle time to identify areas for improvement.

• Exposure to Semiconductor Fabrication:
  Experience working with semiconductor fabrication processes and procedures in areas such as Ion Implant, RTP, GS or Selective Dry Etch.
• Process Transfer and Implementation:
  Exposure to transferring and applying new processes, procedures, and technologies from research and development into production in a fabrication facility.
• Metrology and Data Analysis:
  Experience working with automated inspection metrology and data analysis to improve yield across wafer fabrication processes.
• Equipment Installation and Maintenance:
  Exposure to overseeing the installation, maintenance, and repair of semiconductor fabrication equipment.
• Manufacturing Systems Analysis:
  Experience working with manufacturing systems analysis and improvement, including cycle time, WIP.

• Advanced Metrology Techniques:
  Experience working with advanced metrology techniques, including XRD, Rs, XPS, ellipsometry, etc, inspection and data analysis, to improve yield across wafer fabrication processes.
• Cross-Functional Collaboration:
  
  Exposure to collaborating with cross-functional engineering teams to facilitate and streamline manufacturing control systems. New process establishment.

IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.