Packaging Integration Engineer; College Graduate

Job Title

Global Foundries (GF) is seeking a new college graduate to support the development of industry-leading electro-optical transceivers using GF's Photonix platform and advanced 2.5D and 3D co-packaged optics form factors.

• Support Silicon Photonics advanced packaging innovation and customer design enablement by contributing to packaging design rules, product requirements, and efficient manufacturing processes with internal teams and OSAT ecosystem partners.
• Participate in cross-functional design reviews and use engineering analysis to help resolve technical, manufacturability, reliability, and yield concerns for new customer products.
• Develop and apply analysis or simulation models to evaluate package performance, manufacturability, cost, and quality, and document findings and recommendations for engineering stakeholders.
• Contribute to qualification robustness and continuous improvement plans by applying consistent design processes, tracking requirements, and supporting product development from concept through production readiness.

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

• Education – Graduating with Bachelor's or Master's in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering or related field from an accredited degree program.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Language Fluency
  - English (Written & Verbal)
• Travel
  - Up to 10%

• Prior related internship or co-op experience.
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.
• Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills
• Strong planning & organizational skills
• Coursework, research, internship, or project experience in advanced packaging, chip-package co-design, photonics, thermal or mechanical analysis, materials, reliability, or packaging process integration.

#NCG Program US

Expected Salary Range

$58,400.00 - $

The exact Salary will be determined based on qualifications, experience and location.