Failure Analysis Engineer III

Brief Description

Experienced Sr. Electrical Failure Analysis Engineer to perform debug, fault isolation, and root cause analysis of prototype and production devices. The candidate will have the experience in Semiconductor FA to help guide lower level Engineers through the process and have the knowledge and Leadership to justify lab investments for us to strive to be “Best in Class”

Experienced Sr. Electrical Failure Analysis Engineer to perform debug, fault isolation, and root cause analysis of prototype and production devices. The candidate will have the experience in Semiconductor FA to help guide lower level Engineers through the process and have the knowledge and Leadership to justify lab investments for us to strive to be “Best in Class”

• Perform electrical verification and fault isolation on highly complex ICs (Analog, Digital, ASICs, Microprocessors, etc.) in package, die, or wafer form to determine the failure mechanism.
• High level understanding of FA tools demonstrating beginning subject matter expertise requiring little supervision.
• Replicate ATE test data on the manual FA bench using ATE datalogs, product datasheets, curve tracers, parametric analyzers, AC/DC test equipment, and collaborate with product and test engineers.
• Works on more complex assignments where judgement and initiative are required and acts as a quality agent and drives others to a quality mindset.
• Ability to gather and interpret PEM (photon emission microscopy), TIVA (Thermal Induced Voltage Alterations) and Thermal hot spot data and drive to the correct failure location using CAD design data.
• Performs material characterization of the failure mechanism (SAM, X-RAY, SEM, EDS, cross-sections, etc.) to assist with root cause analysis.
• Performs decapsulation of various packages including hermetic and plastic molded packages utilizing various techniques such as chemical, laser and mechanical methods.
• Performs deprocessing of die or wafers using a combination of chemical, mechanical or RIE etching. Must be able to work with caution and safety in mind while working with chemicals and physical de-processing with an attention to detail.
• Works closely with the Manufacturing organization, Assembly, Product, and Test Engineering to understand the organizations goals and help them meet all requirements and deadlines, by turning around FA requests in a timely manner.
• Work in a hands-on position where the individual will be doing the majority of their work on an independent basis.

• Perform installations of FA equipment and coordinates maintenance and testing procedures to ensure proper working order of FA tools.
• Proactively writes and maintains Failure Analysis Lab procedures. Effectively compiles comprehensive DPA construction analysis reports.
• Identifies and addresses potential areas for improvement including tools, cycle time, utilization and cost.
• Helps management prioritize the job queue and maintain alignment with department goals.
• Mentors and guides junior analysts on lab tools and techniques.
Able to handle several active projects at one time (multitask) with some assistance or instruction. Able to conduct research and develop new capabilities based on project needs.

• Bachelor’s degree in Electrical Engineering, Microelectronics, or related engineering degree.
• At least 5 years of experience performing electrical fault isolation and root cause identification. bility to verify the electrical failure mode and identify the failure mechanism. Help the customer with root cause analysis.

• Advanced knowledge of semiconductor products, device layout, and process technologies.
• Advanced knowledge and understanding of analog, mixed signal, Asic, and power semiconductor…