HIVAC Engineer

Job Description

As an HIVAC Engineer, you will serve as a technical cornerstone for our semiconductor manufacturing operations, driving the research, development, and long-term sustainability of ion implantation, epitaxial growth processes, and metrology technologies. You will leverage a deep understanding of scientific and engineering principles to solve complex technical challenges, utilizing data analysis to ensure process stability, equipment qualification, and continuous improvement. This role requires a highly skilled troubleshooter capable of addressing electrical and process-related issues across CMOS, Bipolar, and BiCMOS technologies, with proficiency in analytical tools such as JMP, Excel, and PROMIS.

• You have technical experience with Axcelis ion implanter platforms, including 8200P, NV-GSD-180, NV-GSD HE, LED, and Purion systems.
• You have experience with epitaxial (EPI) growth tools and related process technologies.
• You have experience developing and sustaining 0.35 m to 0.13 m RFCMOS and SiGe BiCMOS processes.
• You possess a strong understanding of Statistical Process Control (SPC) and its practical application in semiconductor manufacturing.
• You can work closely with device, integration, and yield engineers in a matrixed organization to drive advanced process module development, process control, and continuous improvement.
• You can investigate and verify issues reported by Yield Engineering and evaluate equipment-induced process impacts.
• You can collaborate with Process Technicians to address daily manufacturing issues, prioritize activities, and resolve held-lot situations.
• You can develop and implement process improvements, including variable DCOPs and implant recipe optimization.
• You can analyze E-test data, disposition non-conforming wafers and lots, apply SPC methodologies to improve yield, and recommend corrective actions to resolve E-test issues.
• You can utilize advanced analytical tools and methodologies to solve wafer fabrication challenges.
• You can actively participate in cross-functional teams to resolve technical manufacturing issues.
• You can develop and maintain implant operation procedures, specifications, and technical documentation.
• You can develop tools and methodologies to enhance failure analysis capabilities.
• You can evaluate and recommend capital equipment investments to improve analytical and process capabilities.

• Bachelor's degree in Chemistry, Materials Science, Electrical Engineering, Physics or a related field required;
  Master's degree or Ph.D. strongly preferred.
• Minimum of 1-5+ years of hands‑on experience operating, maintaining, or supporting Axcelis ion implantation platforms, including 8200P, NV-GSD-180, NV-GSD HE, LED, or Purion systems.
• Minimum of 1-5+ years of hands‑on experience with silicon‑germanium (SiGe) epitaxial growth processes and EPI equipment.
• Demonstrated proficiency in Bipolar, CMOS, BiCMOS, or related semiconductor fabrication technologies, including process characterization and device performance evaluation.
• Proven analytical and problem‑solving skills, including root‑cause analysis and implementation of data‑driven process improvements.
• Strong communication skills with the ability to present complex technical findings to cross‑functional teams and management through effective data visualization and technical documentation.

Compensation: $100,000 - $153,000