Manufacturing Process Engineer - SMT Job North Branford area,Connecticut USA,Engineering

Job Description

The Manufacturing Process Engineer - SMT / PCBA is responsible for developing, validating, sustaining, and continuously improving surface mount technology processes used to assemble printed circuit boards. The role provides hands-on engineering ownership from new product introduction through mature production, with emphasis on safe execution, process capability, first-pass yield, equipment reliability, cost, and on-time delivery. The engineer works across Operations, Quality, R&D, Supply Chain, Maintenance, and external equipment or manufacturing partners to deploy repeatable, data-driven solutions that can be understood and applied globally.

You will report directly to our Sr Advanced Manufacturing Engineering Manager, and you'll work out of our Northford, CT location on 100% on-site work schedule.

Responsibilities

Key Responsibilities:

Own and improve end-to-end SMT processes including solder paste printing, SPI, component placement, reflow, AOI, AXI, depaneling, rework, and associated material handling.
Develop and maintain process specifications, equipment recipes, setup sheets, control plans, PFMEAs, work instructions, and training materials.
Support NPI builds and product transfers; lead DfM/DfA/DfT reviews, tooling readiness, process validation, capability studies, and production release activities.
Use SPC, DOE, capability analysis, defect Pareto analysis, and structured root-cause methods to improve FPY, OEE, throughput, changeover time, rework, scrap, and labor productivity.
Troubleshoot process, material, design, programming, feeder, nozzle, printing, placement, soldering, and inspection issues; implement verified corrective and preventive actions.
Create and optimize placement programs, component libraries, feeder and nozzle strategies, stencil designs, reflow profiles, and AOI/SPI/AXI inspection programs.
Establish preventive and predictive maintenance requirements with Maintenance; monitor calibration, equipment health, spare parts, obsolescence, and recovery plans.
Ensure process controls support applicable product, quality, ESD, moisture-sensitive device, safety, environmental, and customer requirements.
Partner with design engineering and suppliers to resolve PCBA manufacturability and component or material issues before and after release.
Lead Lean / Six Sigma improvement events and capital projects; define requirements, evaluate suppliers, validate equipment, and manage technical risk, schedule, and benefits.
Use MES and equipment data to strengthen traceability, process monitoring, standard work, and real-time performance visibility.
Train and mentor engineers, technicians, and operators; build practical troubleshooting capability and sustain a documented skills matrix.
Communicate results through concise technical reports, project reviews, risk escalations, and standard engineering change-control processes.
Provide responsive production support and occasional off-shift support based on manufacturing needs.

Qualifications You Must Have:

5+ years of relevant manufacturing engineering experience, including direct responsibility for SMT / PCBA processes in a production environment.
Hands-on knowledge of solder paste printing, pick-and-place, reflow profiling, SPI, AOI, and PCBA defect analysis.
Working knowledge of statistical process control, process capability, designed experiments, measurement systems, and structured problem solving.
Experience developing manufacturing documentation and supporting NPI, process validation, equipment qualification, and engineering change control.
Ability to work effectively with global and cross-functional teams and communicate technical information clearly in English.
Ability to safely work in a manufacturing environment and travel up to 25%, including international travel when required.

We Value:

Bachelor's degree in electrical, electronics, manufacturing, mechanical or a closely related engineering field.
Advanced knowledge of IPC-A-610 and IPC J-STD-001; IPC certification is preferred.
Knowledge of IPC-7711/7721 rework and repair practices, J-STD-020/033 moisture-sensitivity controls, and ANSI/ESD S20.20 or IEC 61340-5-1 ESD controls.
Experience with Panasonic, ASM, Juki, or comparable placement platforms;
Koh Young or comparable SPI/AOI systems; and multi-zone convection reflow ovens.
Experience with fine-pitch, BGA, QFN, bottom-terminated components, lead-free and, where applicable, tin-lead soldering processes.
Proficiency with PFMEA, control plans, 8D, DMAIC, DOE, Cp/Cpk, GR&R, and data analysis software.
Lean or Six Sigma Green Belt / Black Belt certification and demonstrated continuous-improvement results.
Experience with MES, equipment connectivity, traceability, SAP or another ERP/MRP system, and automated manufacturing data collection.
Experience specifying, installing, qualifying, or transferring SMT equipment, tooling, fixtures, and automation.
Project management capability including scope, schedule, risk, capital justification, supplier management, and…