Principal Hardware Engineer - DC Hardware

Principal Hardware Engineer - DC Hardware

We are seeking a Principal Hardware Engineer to join our DC Hardware team. In this role, you will design, develop, and validate high-current, high-power sourcing and switching hardware used in semiconductor automated test equipment (ATE).

You will play a key role in advancing power delivery architecture, focusing on fast transient response, load regulation, protection systems, thermal management, and system‑level integration. This position provides the opportunity to own power‑delivery modules from concept through production release, supporting advanced SoCs, high‑power devices, and complex test conditions. You will collaborate closely with cross‑functional teams across hardware, firmware, mechanical, and test engineering to deliver robust, high‑performance solutions.

We are looking for a highly collaborative engineer with deep expertise in power electronics and high‑current hardware design.

• Bachelor’s or Master’s degree in Electrical Engineering or related field
• 8+ years of experience in power electronics, high‑current power delivery, or instrumentation hardware design
• Proven experience architecting and designing high-current power delivery modules (mA to 100+A)
• Strong expertise in switching power supplies, multiphase regulators, linear regulators, and advanced power‑stage topologies
• Experience designing fast‑response voltage/current sourcing circuits optimized for transient performance and dynamic load conditions
• Deep understanding of power integrity and PDN optimization across full signal paths (instrumentation, cabling, loadboard, and DUT)
• Experience modeling and mitigating droop, overshoot, ringing, and ground bounce under fast load conditions
• Proficiency in simulation and analysis of loop stability, compensation networks, and transient response
• Experience designing protection systems including OCP, OVP, OTP, short‑circuit protection, and fault isolation
• Knowledge of reliability engineering, derating techniques, and thermal modeling for long‑term system stability
• Experience with high‑current routing, low‑impedance path design, and system‑level thermal considerations
• Proven ability to lead hardware bring‑up, debug complex analog/mixed‑signal systems, and drive root‑cause analysis
• Hands‑on experience with lab equipment including oscilloscopes, power analyzers, current probes, and electronic loads
• Proficiency with SPICE simulation, PDN modeling tools, and PCB design tools
• Experience collaborating with firmware teams on control loops, telemetry, calibration, and system integration
• Strong analytical, problem‑solving, and communication skills

• Experience designing power‑delivery modules specifically for semiconductor ATE systems
• Knowledge of dynamic voltage scaling, digital power control, and telemetry systems
• Familiarity with high‑current connectors, cabling, and low‑impedance mechanical design principles
• Experience with thermal modeling, heatsink design, and airflow optimization
• Understanding of HALT/HASS, stress testing, and failure‑mode analysis
• Experience supporting system‑level integration including load boards, probecards, and DUT environments
• Track record of contributing to design standards, best practices, or technical mentorship