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Physical Design Lead

Job in North Reading, Middlesex County, Massachusetts, 01864, USA
Listing for: Insight Global
Full Time position
Listed on 2026-07-19
Job specializations:
  • Engineering
    Hardware Engineer, Systems Engineer, Electronics Engineer, Test Engineer
Salary/Wage Range or Industry Benchmark: 200000 - 250000 USD Yearly USD 200000.00 250000.00 YEAR
Job Description & How to Apply Below

Location: North Reading, MA (relocation offered)

Role Type: Permanent

Pay Rate: $200k - $250k base + bonuses, RSUs and benefits

Required Skills & Experience
  • 10+ years of hands‑on ASIC physical design experience, including leadership of large/complex PD projects
  • Experience at advanced technology nodes (16nm and above)
  • Deep expertise in RTL‑to‑GDSII flows and timing closure
  • Strong understanding of STA, constraints development, and signoff methodologies
  • Experience integrating high‑speed and complex IP (e.g., PCIe, DDR5/DDR6, UFS, Ser Des)
  • Proficiency with EDA tools (Cadence preferred)
  • Strong scripting and automation skills using Tcl, Python, and/or equivalent
  • BS or MS in Electrical Engineering
Job Description

Insight Global is seeking an experienced Physical Design Lead to join our Silicon Technology Engineering (STE) organization within the Digital ASIC Group. This team develops advanced‑node, large‑scale mixed‑signal ASICs that are foundational to next‑generation SoC and memory test platforms. In this highly visible technical leadership role, you will own RTL‑to‑GDSII execution for complex ASICs, working closely with digital and analog designers, product architects, and chip leads.

You will guide physical design architecture, mentor engineers, and play a critical role in delivering high‑quality, first‑pass silicon at advanced process nodes.

Key Responsibilities:
  • Lead and mentor a team of physical design engineers across the full project lifecycle
  • Lead high‑level physical design planning and define PD architecture in collaboration with chip and system architects
  • Develop and own chip floor plans, timing budgets, power estimates, and pin planning
  • Drive RTL‑to‑netlist activities including synthesis, logical equivalence checking (LEC), clock domain crossing checks (CDC), and static timing analysis (STA)
  • Support hands‑on place‑and‑route (P&R) for critical and high‑speed blocks
  • Collaborate with a backend physical design house to support P&R execution, debug flow or implementation issues, and meet schedule and quality goals
  • Integrate complex IP such as PCIe, DDR5/DDR6, UFS, and Ser Des
  • Ensure robust signoff closure including DRC/LVS and EM/IR analysis
  • Develop, enhance, and maintain physical design tool flows and automation
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