DFM Process Development Engineer

Process Engineer

Required Skills & Experience
• Bachelor's Degree in Engineering (Manufacturing, Mechanical preferred).
• 2+ years in printed circuit board assembly and manufacturing.
• Knowledge of PCBA processes (solder paste printing, SMT placement, reflow soldering, aqueous cleaning, automated inspection, ESD principles).
• Familiarity with IPC-610, IPC-7711/7721, J-STD.
• Experience with PC layout/design review software (Cadence Allegro, Valor); EMS/CM supplier collaboration desirable.
• Able to travel ~10%; periodic calls with Asian teams and suppliers.

Job Description Opportunity Overview Teradyne's Semiconductor Test Division develops the world's leading equipment for testing electronics. Inside STD, our Operations New Product Introduction Group is looking for a dynamic, technically skilled Process Engineer to engage our Printed Circuit Board development space. This engineer will use their knowledge of PCBA's to influence next-generation test instrument product designs from concept to volume release with DFM principles, create and run experiments, and support the development of new assembly processes.

Key Responsibilities:

• Collaborate with Hardware Design on New Product initiatives, influencing Printed Circuit Board Assembly product development with Design for Manufacturability principles.
• Drive failure analysis for electrical components and PCBA solder defects.
• Develop and support Teradyne PCBA Design for Manufacturability guidelines and assembly best practices; drive improvements and updates to NPI process documentation.
• Support Operations NPI objectives by executing component assessment, manufacturing process development, and fault-down activities for printed circuit board assemblies.
• Work with contract manufacturing teams to support new PCBA initial builds, experiments, and failure analysis.
• Lead NPI Lessons Learned activities, integrating feedback from high-volume manufacturing into NPI processes.