Senior Associate - Semiconductor

Lumenci is seeking a Senior Associate – Semiconductor to support high-impact patent litigation, IP strategy, and monetization engagements across advanced semiconductor technologies. This role is ideal for engineers with hands‑on experience in IC design, semiconductor device engineering, process integration, or advanced packaging
, who are eager to apply deep technical expertise in complex IP and legal environments.

• Employment Type: Full‑time, exempt

• Work Arrangement: Remote, US‑based

• Location: Candidates may be located anywhere in the United States, subject to being legally authorized to work in the United States without sponsorship.

• This role may require approximately 40% domestic travel for client meetings, expert meetings, lab and teardown visits, design/source code reviews, depositions/trials, and conferences.

• Contribute as an individual contributor on client projects involving semiconductors, SoCs, integrated circuits, and advanced packaging/process technologies.

• Deliver patent analysis and IP monetization research related to semiconductor technologies, including technology due diligence, claim charting/infringement analysis, prior art searching, market research, and target scouting for semiconductor portfolios and products.

• Analyze and reverse engineer implementations of semiconductor devices and process technologies, such as:

  • Logic and memory ICs, SoCs, RF / analog / mixed‑signal devices
  • Advanced process nodes and device structures (e.g., FinFET, GAA, 3D NAND)
  • Advanced semiconductor packaging (e.g., 2.5D/3D, chiplets, HBM, interposers) using industry‑standard analysis techniques and tools (e.g., teardowns, delayering, cross‑sectioning, SEM/TEM, EDS, circuit extraction) as well as custom approaches.

• Design and execute technical analysis plans and experiments to evaluate device structures, process flows, packaging approaches, and performance characteristics, and connect the resulting findings to patent claims, standards, and accused products.

• Review datasheets, design documentation, process/technology briefs, foundry collateral, and standards documents related to semiconductor devices and advanced packaging, and map technical details to patent claims and commercial implementations.

• Support Expert Witnesses and attorneys on IP litigation matters, including:

  • Technical analysis for expert and consulting reports
  • Review of design files, RTL/HDL, layout / GDSII, and process documentation
  • Preparation for depositions, hearings, and trials

• Collaborate with project leads and senior consultants to prepare client deliverables and presentations that clearly explain complex semiconductor architectures, process technologies, and packaging approaches to both technical and non‑technical audiences.

• Assist in maintaining relationships with existing and prospective clients by supporting technical discussions, demos, and workshops focused on semiconductor and advanced packaging IP opportunities.

• Collaborate with Lumenci’s product teams to provide input on requirements, testing, and roadmap for technology platforms related to semiconductor reverse engineering, technical content build, and IP analytics.

• Contribute to thought leadership in semiconductor and IP, including blogs, whitepapers, research summaries, and internal training on semiconductor devices, process technologies, and IP strategy.

• Collaborate across the organization within‑person and distributed global teams; attend internal and external meetings, workshops, conferences, lab visits, design / source code reviews, depositions, and trials as needed.

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Microelectronics, Materials Science, or a closely related field with a focus on semiconductor devices, IC design, or fabrication.

• 2–4 years of hands‑on experience working with semiconductor or semiconductor‑adjacent systems in an R&D, design, process, test, characterization, or consulting role (for example, IC design, verification, device or process engineering, advanced packaging, or failure analysis), including implementing, characterizing, or optimizing semiconductor devices or process…