×
Register Here to Apply for Jobs or Post Jobs. X

Remote Substrate IC Package Design Engineer Speed

Remote / Online - Candidates ideally in
Gilbert, Maricopa County, Arizona, 85233, USA
Listing for: black.ai
Remote/Work from Home position
Listed on 2026-05-30
Job specializations:
  • Engineering
    Electrical Engineering, Engineering Design & Technologists
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below
Position: Remote Substrate IC Package Design Engineer – High‑Speed

black.ai is seeking a talented individual to join as a Substrate IC Package Designer, focusing on the development of advanced substrate designs for high-performance packaging. You will work at the intersection of design disciplines, ensuring feasibility and performance while leading complex projects that directly impact technology's future.

The role requires a Bachelor’s or Master’s degree in Electrical Engineering and at least 5 years of experience in substrate design. We offer competitive salaries, equity opportunities, and a collaborative work environment with a commitment to diversity.

#J-18808-Ljbffr
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
 
 
 
Search for further Jobs Here:
(Try combinations for better Results! Or enter less keywords for broader Results)
Location
Increase/decrease your Search Radius (miles)
0
200
Filters
Education Level
Experience Level (years)
Posted in last:
Salary