Sr. Principal Engineer, Photonics Solutions

Intel Integrated Photonics Solutions (IPS) stands at the forefront of silicon photonics integration and commercialization. Since announcing the world's first hybrid silicon laser nearly a decade ago, our team leads the industry with cutting‑edge technology and efficient, scalable high‑volume manufacturing. Our mission is to enable the next generation of data centers and AI infrastructure through transformative silicon photonics solutions. From 400G to 3.2T+ and beyond, we drive unprecedented bandwidth growth while achieving smaller form factors through advanced packaging and system integration.

• Own and drive the delivery of photonics solutions that align with the strategic technical vision for next‑generation AI infrastructure connectivity.
• Collaborate with cross‑functional teams to deliver breakthrough photonic products that enable massive AI compute scaling.
• Define system‑level product architectures that enable unprecedented AI compute density and performance, and drive strategic technology roadmaps for Intel’s Silicon Photonics strategy for AI infrastructure.
• Lead technical excellence across domains by orchestrating seamless integration among photonic components, electronic interfaces, thermal management, packaging, and AI system requirements.
• Pioneer next‑generation solutions, spearheading the development of novel architectures such as 112
  
  Gbaud+ connectivity, advanced multi‑wavelength systems, and innovative packaging approaches for AI workloads.

• PhD in Electrical Engineering, Physics, Optical Engineering, or a related discipline with ≥8years of experience in a related field and ≥8years of relevant industry experience.
• ≥8years of experience in silicon photonics system architecture and integration from concept to high‑volume manufacturing.
• 10+years of experience designing and architecting photonic systems for high‑performance computing or AI applications.
• Proven track record leading complex, multi‑disciplinary technical programs involving photonic systems.
• Deep expertise in optical interconnect architecture.
• Strong background in AI/ML infrastructure requirements and compute interconnect scaling challenges.
• Experience with system‑level modeling and/or performance optimization for high‑bandwidth optical links.
• Demonstrated technical leadership experience directing senior engineering teams.
• Cross‑functional collaboration skills working with AI hardware, process, test, packaging, and applications teams.
• Executive communication abilities presenting strategic technical vision to senior leadership and external partners.
• Strategic problem‑solving mindset with demonstrated ability to architect solutions for complex system‑level challenges.

• Technical leadership experience leading large, multi‑site engineering organizations.
• Deep experience with AI training and inference infrastructure requirements (GPU clusters, distributed computing).
• Knowledge of advanced packaging technologies for high‑density optical interconnects.
• Experience with industry standards development (OIF, IEEE, OCP) for optical interconnects.
• Familiarity with foundry/fab ecosystems and supply‑chain management for photonic solutions.
• Publications in peer‑reviewed journals on optical interconnects or AI infrastructure.
• Customer‑facing experience with hyperscale data center operators and AI companies.
• Exposure to advanced modulation formats, WDM, optical switching architectures, and thermal management for high‑density optics.
• Experience with co‑design methodologies linking photonic hardware with AI software stacks.
• Knowledge of emerging technologies such as linear‑drive modulators, advanced detector arrays, optics switching matrices.

Experienced Hire | Shift 1 (United States) | Primary

Location:

Virtual (US)

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. This position is a Position of Trust and requires a background investigation.

We offer a total compensation package that ranks among the best in the industry. It includes competitive pay, stock bonuses, and benefit programs covering health, retirement, and vacation.

Annual Salary Range for US: $ – $ USD. The range reflects the minimum and maximum target compensation for the position across all US locations; individual pay is determined by work location and other factors.

Work Model:
Fully home‑based, with occasional site visits as needed. You must reside in a country where Intel has a legal presence; remote work from other countries is not permitted.