Chip Lead

Business Line

Description:

AI & Chip Engineering team defines and develops System on Chip, ASIC’s, Digital and Analog IP’s for a wide range of products, including Automotive microprocessors, Application processors, Data Center and network processors.

Job Summary:

Lead product execution for Automotive ASIL-B/D SoC’s & Data Center SOCsWork with Systems, Marketing, PE/TE and Arch engineering to define the part. Generate and analyze data to take right and cost effective architecture decision

Work with IP, Technology, packaging partners to assess the right IP/packages and technology options for the part.

Work with IP and SoC functions (frontend, verification, AMS, DFT, Emulation, Validation, Physical implementation) to understand and resolve inter/intra functional handoff and challenges.

Oversee definition management and make sure the implementation complies with the requirements

Work closely with downstream teams dependent on SOC, who are working on post-silicon activities, to make sure their needs are addressed

Work closely with Test and Product engineering teams to enable productization.

Work closely with post silicon evaluation teams (functional and analog Validation, Characterization, Application and Software teams) and address design issues.

Work with Program management office for management attention and clearly articulate dependencies and help needed for timely execution of projects.

Assess workload and resource demands based on complexity and create predictable project plans meeting customer requirements

Mentor engineers across various functions

Key Challenges:

Automotive SoC development pose additional challenges specific to implementation of safety mechanism

Automotive SoC development requires ensuring very high quality and reliability, ensuring a very low ppm defectivity over an long product life time.

The role includes leading the teams in a matrix organization, assimilating information from across functional teams and analyzing it in product context

Understand impact of architecture on logical and physical realizability

Working within resource and schedule constraints

Cross functional aspects:

This role is primarily about leading cross functional teams

During part definition is includes a close interaction with Business, Systems, Architects, third party IP vendors

During execution a close interaction and decision making is required between Technology, packaging, IP, Architecture, Various implementation functions, Test and Product Engineering.

Post silicon, close collaboration is needed with Software, Test and production engineering, Application and Field teams.

Overall, Chip lead is central design point of contact for all cross functional teams associated with the part.

Job Qualifications:

Bachelors in Engineering with at 15 years of design development experience, with at least 5 years of leading complete design and design functions.

MS in Electrical Engineering preferred (higher level education may substitute for some experience).Experience in leading Global cross functional teams

Experience in leading designs in smaller geometries desired

Job location:

The role is based in Austin/US. This is a hybrid role with a few days in the office each week and the remaining days are work from home.

More information about NXP in the United States...NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.#LI-6692
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