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Remote Principal Microelectronics Architect; Secret

Remote / Online - Candidates ideally in
Bloomington, Monroe County, Indiana, 47401, USA
Listing for: TAP Engineering
Full Time, Remote/Work from Home position
Listed on 2026-09-02
Job specializations:
  • Engineering
    Systems Engineer, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 120000 - 160000 USD Yearly USD 120000.00 160000.00 YEAR
Job Description & How to Apply Below
Position: Remote Principal Microelectronics Architect (Secret)

Principal Microelectronics Architect (SME)

Remote (U.S.) | Full-Time | Secret Clearance Required

Position: Principal Microelectronics Architect (SME)

Location: Remote (Periodic On-site Support as Needed)

Category: Hardware Engineering / Systems Architecture

Clearance Requirement: U.S. Citizenship Required;
Active Secret Clearance

Education Requirement: Bachelor's Degree in Electrical Engineering, Computer Engineering, or related discipline (Master's or PhD preferred)

Experience Requirement: 10+ Years in Microelectronics Design, Semiconductor Development, or IP Architecture

Position Overview

We are seeking an experienced Principal Microelectronics Architect to serve as a Subject Matter Expert (SME) supporting a critical government-sponsored microelectronics modernization initiative. This role will provide technical leadership in the development of a secure, collaborative design environment focused on advancing semiconductor innovation, intellectual property reuse, and next-generation design workflows.

The selected candidate will work within a highly technical team responsible for defining architecture, standards, and governance models that support the development and integration of advanced microelectronics technologies. This position offers the opportunity to influence long-term strategy while working closely with government stakeholders, industry partners, and engineering teams across the semiconductor ecosystem.

The ideal candidate brings deep expertise in microelectronics design, silicon IP, system-on-chip (SoC) architecture, FPGA technologies, and semiconductor design workflows, along with the ability to communicate complex technical concepts to both technical and executive audiences.

Key Responsibilities

Strategic Technical Leadership

  • Serve as a trusted technical advisor supporting the development of secure, cloud-enabled microelectronics design environments
  • Provide expertise in semiconductor design methodologies, silicon IP reuse, and design ecosystem modernization
  • Guide architectural decisions that support long-term scalability, interoperability, and sustainability
Intellectual Property Management & Governance
  • Develop and validate standards for managing reusable design IP repositories
  • Establish best practices for secure integration and lifecycle management of commercial and government-developed IP assets
  • Assess technical risks, licensing considerations, and long-term sustainability of IP portfolios
  • Support governance strategies that promote efficient IP sharing and collaboration
Design Flow & Technology Integration
  • Evaluate and optimize semiconductor design workflows across modern engineering environments
  • Support the integration of foundry-qualified design flows and advanced packaging technologies
  • Promote interoperability across multiple vendors, tool chains, and semiconductor platforms
  • Identify opportunities to accelerate development timelines and improve engineering productivity
Technical Assessments & Program Execution
  • Conduct technology evaluations and produce technical assessment reports
  • Deliver recommendations related to design infrastructure, tool interoperability, and ecosystem scalability
  • Support milestone reviews and provide technical briefings to program leadership and stakeholders
  • Contribute to strategic roadmaps that support future program growth and modernization efforts
Stakeholder Collaboration
  • Coordinate requirements and technical activities across government organizations, industry partners, research institutions, and engineering teams
  • Facilitate collaboration among stakeholders focused on semiconductor design, fabrication, packaging, and testing
  • Build consensus around standards, processes, and technical direction


Required Qualifications

  • Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical discipline
  • 10+ years of experience in microelectronics design, semiconductor development, FPGA design, or System-on-Chip (SoC) architecture
  • Deep understanding of silicon IP development, integration, validation, and reuse methodologies
  • Experience evaluating and managing third-party intellectual property within complex hardware environments
  • Familiarity with industry-standard Electronic Design Automation (EDA) tools, including:
    • Cadence
    • Synopsys
    • Siemens EDA
  • Understanding of cloud-enabled design environments and collaborative engineering workflows
  • Strong knowledge of semiconductor design processes and technology development life cycles
  • Exceptional technical writing, documentation, and presentation skills
  • Ability to communicate complex technical concepts to both engineering teams and executive leadership
  • U.S. Citizenship with the ability to obtain and maintain a Secret security clearance


Preferred Qualifications

  • Active Secret clearance or higher preferred
  • Experience supporting government-sponsored microelectronics programs
  • Familiarity with trusted semiconductor manufacturing and supply chain assurance initiatives
  • Experience with advanced packaging technologies and chiplet architectures
  • Knowledge of modern…
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