Advanced Packaging Dry Etch Module Development Engineer

Location: Vernonia

Job Description

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions.

Key Responsibilities

- Develop and optimize plasma etch processes for advanced packaging applications
- Design experiments (DOE) to characterize process windows and optimize etch performance
- Develop and execute technology roadmaps to meet future manufacturing needs while pushing industry standards forward.
- Partner with equipment suppliers to design, test, and implement innovative process solutions.
- Monitor and optimize production efficiency, yield, and manufacturing techniques for existing products.
- Identify and implement modifications to improve equipment performance, reduce costs, and enhance production output.
- Collaborate cross-functionally to develop scalable, robust manufacturing solutions aligned with Intel's strategic objectives.

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates

Minimum Qualifications

- Master or PhD degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
- Master's degree with at least 4 years of experience, or PhD with at least 2 years of experience.

Experience listed above should be a combination of the following:

- Process development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.

- Design of Experiments (DOE), process development methodology, statistical process control, and/or manufacturing process improvement.
- Experience with plasma etch equipment platforms

Preferred Qualifications

- Experience in wafer-level assembly, advanced packaging, or related technologies.
- Demonstrated success in leading programs from initial strategy development through high-volume production.
- Technical leadership experience in solving complex engineering challenges and driving industry-leading solutions.
- Strong cross-functional collaboration skills with stakeholders in yield, operations, and other functional areas.

Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the boundaries of semiconductor technology. Join us to help shape the future of innovation. Apply now and become a part of Intel's mission to create world-changing technologies that improve lives.

Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits

Annual Salary Range for jobs which could be performed in the US $-$

* Salary range dependent on a number of factors including location and experience

Working Model
This role will require an on-site presence.
* Job posting details (such as work model, location or time type) are subject to change.