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Dry Etch Process Develop Engineer

Job in Orem, Utah County, Utah, 84057, USA
Listing for: Micron Technology, Inc
Full Time position
Listed on 2026-06-04
Job specializations:
  • Engineering
    Process Engineer, Manufacturing Engineer, Electronics Engineer, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 60000 - 80000 USD Yearly USD 60000.00 80000.00 YEAR
Job Description & How to Apply Below
Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the leading edge of memory innovation, partnering across design, integration, manufacturing, and equipment suppliers to enable the next generation of semiconductor devices. This is where curiosity, experimentation, and impact come together.

As a Dry Etch Process Engineer you will develop, integrate, and optimize plasma etch processes that enable next-generation memory devices. You will work hands-on with etch equipment, chamber hardware, consumables, and metrology, using data-driven methods to improve critical dimension control, profile, selectivity, uniformity, and defect performance. You will collaborate closely with integration, lithography, thin films, CMP, device, and manufacturing teams to mature processes from R&D into high-volume manufacturing.

This role is full time at the NYC site in Albany, New York. You will collaborate with our EUV Photo Lithography process team in NYC, and our Technology Development (TD) teams in Boise, USA and Hiroshima, Japan sites to develop robust dry etch solutions aligned to Micron’s technical roadmap. NYC is a diverse consortium, and you will have many opportunities to work closely with suppliers and other companies while protecting Micron’s intellectual property (IP).Responsibilities:

Develop, qualify, and sustain dry etch (plasma) unit processes for advanced memory technologies (e.g., dielectric, conductor, and hardmask etch)
Optimize critical process metrics including CD control, etch profile/anisotropy, selectivity, microloading, uniformity, and line edge/line width roughness

Drive defect reduction and yield improvement using inline/out-of-line metrology, DOEs, SPC, and statistical data analysis

Perform root-cause analysis and implement corrective actions for process excursions, tool health issues, and integration-related failures

Partner with equipment vendors on chamber matching, hardware and recipe development, new capability evaluations, and cost-of-ownership improvements

Document process baselines, change controls, and learning; communicate results and support technology transfer to high-volume manufacturing

Minimum Qualifications:

M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related engineering/technical field relevant to plasma processing and semiconductor manufacturing

B.S. with 3+ years of semiconductor processing experience with emphasis on dry etch/plasma etch will also be considered

Experience in semiconductor process development or sustaining engineering, including DOE planning/execution and statistical data analysis

Working knowledge of plasma etch fundamentals, chamber hardware, and process characterization (profile, CD, selectivity, uniformity, defectivity)
Ability to collaborate effectively across cross-functional technical teams and communicate results clearly

Preferred Qualifications:

Hands-on experience with advanced dry etch platforms (e.g., ICP/RIE) and chamber matching across fleets

Familiarity with pattern transfer challenges (ARDE, microloading, footing/notching) and integration with lithography/hardmask stacks)

Experience with defect characterization techniques and tool health monitoring methodologies

Experience working with semiconductor equipment vendors, joint development programs, or R&D environments

Familiarity with technology transfer to high-volume manufacturing and sustaining support in a fab environment

The US base salary range that Micron Technology estimates it could pay for this full-time position is:$ - $ a year Additional compensation may include benefits, bonuses and equity.

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target…
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