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ElectroMechanical Design Engineer Stf

Job in Orlando, Orange County, Florida, 32885, USA
Listing for: Lockheed Martin
Full Time position
Listed on 2026-06-02
Job specializations:
  • Engineering
    Systems Engineer, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below

Role Overview

Electro Mechanical Design Engineer for the Missiles & Fire Control (MFC) Electromechanical Engineering organization. The team delivers high reliability hardware that powers precision engagement systems for the United States and allied militaries, and sets the technical direction for electromechanical solutions across the MFC portfolio.

Responsibilities
  • Lead Integrated Product Teams (IPTs) and serve as the primary technical liaison for customers, ensuring clear communication of requirements, risks, and status.
  • Architect, design, and validate advanced circuit card packages that support ASICs, System on Chip (SoC), and Multi Chip Package (MCP) solutions.
  • Create high density circuit cards, cable assemblies, and interconnects that meet stringent size, weight, power, security, and performance constraints.
  • Develop electromechanical subsystems—printed wiring boards, harnesses, and sub‑assemblies—for flagship programs, special initiatives, and IRAD projects.
  • Conduct thermal, signal integrity, and electromagnetic compatibility analyses to guarantee robust operation in harsh DoD environments.
  • Drive design assurance reviews, track issues, and lead corrective action closure.
  • Coordinate with systems, hardware, software, test, and supply chain teams to deliver high quality results on schedule and within budget.
  • Manage risk, schedule, and earned value metrics, and report status to senior leadership.
  • Set clear technical direction for program engineers based on customer needs and program goals.
  • Mentor and develop engineers, foster an inclusive culture, and champion continuous improvement initiatives.
  • Prepare and deliver concise technical briefings, risk assessments, and recommendations to internal stakeholders and external customers.
Basic Qualifications
  • Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university;
    Master’s degree or PhD preferred.
  • Minimum 5 years of professional experience in Electromechanical Engineering or related discipline.
  • Proficient in CREO modeling and electromechanical system design.
  • Proficient with CCA/PWB, cable/harness design and development, and electronic packaging design.
  • Technical or project leadership experience supporting the production of high‑reliability electronics products.
  • Project leadership/management experience throughout the engineering/production lifecycle: scoping, sizing, cost estimation, planning, scheduling, staffing, tracking, and earned value management (EVM).
  • Experience in presentation, oral and written communication to facilitate effective and efficient interchanges between co‑workers, leaders, and customers.
  • Experience working with cross‑functional teams across multiple locations.
  • Experience capturing flowed and derived requirements for electromechanical designs.
  • Must be a U.S. Citizen; must possess or be able to obtain a DoD Secret security clearance.
Desired Skills
  • Direct experience supporting production (manufacturing and test).
  • Demonstrated leadership skills and behaviors that align with Full Spectrum Leadership Imperatives.
  • Preparation for and participation in major program design reviews (PDR, CDR).
  • Experience troubleshooting and resolving technical issues.
  • Proven understanding of electronics standards and processes.
  • Proven understanding of mechanical standards and processes.
  • Proven understanding of electronic packaging principles.
  • Demonstrated ability to multitask and adapt to changing priorities.
  • Experience with Zuken E3 and Windchill.
  • Experience with military defense hardware.
  • Familiarity with SoC/MCP solutions and ASIC verification and validation testing at the circuit card level.
  • Experience with parts and material selections.
  • Ability to perform design trade studies evaluating cost, weight, packaging, and power benefits.
  • Familiarity with CAMEO.
  • Flex circuit and microelectronics design experience.
  • Active DoD Secret or Top Secret Clearance.
Location

This position is in Orlando.

Security Clearance

MUST BE A U.S. CITIZEN. The selected candidate must be able to obtain a Secret clearance.

EEO Statement

Lockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.

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